摘要
本论文采用热压烧结方法 ,选择Zn作为烧结助剂 ,进行了不同W含量的Cu W烧结体的低温致密化研究。各烧结体在相同的烧结工艺条件下 (112 3K ,2 0MPa ,1h)相对密度均达到 97%以上。在此基础上 ,成功地制备出了整体致密的Cu W体系梯度材料 ,其W含量沿厚度方向在 0～ 2 5 % (质量分数 )
The densification of Cu W with different W content at relatively low temperature was studied with the sintering activitor of Zn by hot press sintering process. The relative density of all sintered compacts is above 97 0% at the same condition(1123K,20MPa,1h).Cu W system FGM was successfully fabricated.Along the direction of thickness, the content of W changes from 0 to 25wt%
出处
《硅酸盐通报》
CAS
CSCD
2001年第2期49-50,共2页
Bulletin of the Chinese Ceramic Society
