摘要
利用 DSC和 XRD研究了化学沉积 Ni- Cu- P合金镀层的组织结构和晶化过程 .结果表明 :随着镀层中 Cu含量的升高 ,Ni- Cu- P合金镀层向亚稳中间相 Ni5P2 及 Ni12 P5转变和亚稳中间相Ni5P2 及 Ni12 P5向热力学稳定的 Ni3P相转变的温度均逐渐升高 ;非晶态结构的合金镀层 (质量分数 ) Ni- 8.47% Cu- 1 5.39% P、Ni- 1 5.35% Cu- 1 3.90 % P及 Ni- 1 9.71 % Cu- 1 2 .83% P在 30 0°C加热后仍保持非晶态 ,而在 363.39°C、363.69°C及 370 .0 4°C,这 3种合金镀层分别转变为亚稳中间相Ni5P2 及 Ni12 P5,随着温度的升高在 42 8.2 0°C、442 .54°C及 453.96°C,合金镀层中的亚稳中间相Ni5P2 及 Ni12 P5又进而转变为稳定相 Ni3P;对于晶态结构 (质量分数 ) Ni- 56.49% Cu- 6.0 1 % P合金镀层 ,在 1 70～ 330°C,镀层中 Ni- Cu晶粒粗化、磷元素向晶界偏聚 ,在 397.80°C镀层中的非晶相转变为亚稳中间相 Ni5P2 ,在 464.89°C亚稳中间相 Ni5P2 转变为稳定相 Ni3P.
Microstructures of electroless Ni-Cu-P deposition were studied by DSC and XRD. The results show that both the temperatures of Ni-Cu-P deposits transforming to metastable phases Ni5P2 and Ni12P5, and metastable phases Ni5P2 and Ni12P5 transforming to thermodynamics equilibrium phase Ni3P increase gradually; the amorphous Ni-8.47%Cu-15.39%P, Ni-15.35%Cu-13.90%P and Ni-19.71%Cu-12.83%P deposits still remain to be amorphous after heated at 300°C; while at 363.39°C, 363.60°C, 363.60°C and 370.04°C, the amorphous deposits transform to the metastable phase Ni5P2 and Ni12P5 respectively; as the temperatures increase, at 428.20°C, 442.54°C and 453.96°C, the metastable phases Ni5P2 and Ni12P5 in the deposits ulteriorly transform to the stable phases Ni3P; for the crystal Ni-56.49%Cu-6.01%P deposit, Ni-Cu grains grow and P segregates to the grain boundaries at 170-330°C, at 397.80°C the amorphous phases in the deposits transform to the metastable phases Ni5P2; the metastable phases Ni5P2 transform to the stable phase Ni3P at 464.89°C.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2001年第3期343-347,共5页
Journal of Shanghai Jiaotong University
基金
国家"九五"科学仪器科技攻关资助! (96 -A2 3-0 5 -0 1)项目
