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Cu在Ni-Mo-P镀层的低温扩散行为 被引量:1

Diffusion behavior of Cu in Ni-Mo-P coating at low-temperature
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摘要 通过化学镀的方法在Cu基底上制备了不同晶态的Ni—Mo—P镀层,对Ni-1.0at%Mo-17.0at%合金镀层进行了200~600℃的真空热处理后,利用X射线荧光光谱仪、X射线衍射仪、俄歇电子能谱仪、能量散射谱仪对样品的厚度、成分、物相结构进行了表征与分析。结果表明,随着P含量的增加,合金镀层的晶态由结晶到混晶、非晶转变。随着热处理温度的增加,镀层本身结晶性提高,cu原子扩散到镀层中,从而影响镀层的晶态。通过计算可得,400和500℃时,Cu扩散量为4.14at%、6.14at%。Cu在Ni.1.0at%Mo.17.0at%合金镀层中的扩散激活能为1.11eV。 The Ni-Mo-P alloy coatings were fabricated by electroless deposition with different composition. The composition and thickness of Ni-Mo-P alloy coatings were tested by X-ray fluorescence spectrometer. The crystalline states,depth profiles of Ni-1.0 at% Mo-17at% coatings after different annealing temperatures for 30 min were investigated by means of X-ray diffraction, Auger electro spectrometer, respectively. The results show the crystallized Ni-Mo-P coatings became to amorphous one with increasing of P content. The diffusion quantity of Cu into Ni-Mo-P coatings at 400 ℃ , 500 ℃ are 4. 14 at% , 6.14 at% calculated through XRD patterns. The activation energy of diffusion for Cu in Ni-1.0 at% Mo-17 at% is 1.5 eV.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2014年第3期209-212,共4页 Transactions of Materials and Heat Treatment
关键词 Cu扩散 非晶 X射线衍射 Cu diffusion amorphous X-ray diffraction
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