摘要
通过分析MEMS器件多层结构界面裂纹疲劳扩展的影响因素及温度应力对界面疲劳的影响机理,建立了温度应力对分层失效影响的理论模型,并建立了双材料结构层的有限元分析模型,研究了温度应力对界面裂纹疲劳扩展的影响规律。研究结果表明:在温度应力作用下,裂纹易沿界面方向扩展;温度幅值升高,裂纹疲劳扩展速率呈指数关系增大;裂纹从形成初期到扩展至分层失效的过程中历经较慢扩展、相对平稳扩展和快速扩展三个阶段。
By way of analyzing the influence factors of interface crack fatigue expanding and affect mechanics of temperature stress in MEMS components＇ multilayer structures, the theory model of temperature stress effect on delamination failure was built. The finite element model of two material structures was built and the influence of temperature stress on crack fatigue expanding was analyzed. The result shows that the crack easily expands along the interface direction, and expanding speed presents exponential relation with temperature. The expanding speed of crack at interface suffers three stages from initial to delamination, including low speed, relatively steady and quickly expanding stages.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第3期84-87,共4页
Electronic Components And Materials
