摘要
将聚乙烯亚胺(PEI)通过静电作用自组装于聚丙烯腈(PAN)多孔基膜表面,形成高分子聚电解质层;进一步通过浸泡法和动态电沉积法,将Cu2+固载于高分子聚电解质层上,制备出新型Cu2+固载超滤膜.研究结果表明,Cu2+固载超滤膜的PEI层和Cu2+均具有较高稳定性;该分离膜对腐植酸的截留率高达99.0%,且具有优良的抑菌性能,抑菌率高达85.7%.此外,相对于静态浸泡法,动态电沉积法是一种更有效的Cu2+固载手段,不仅大幅缩短了固载时间,还显著提高了Cu2+固载率.
Polyethylenimine（PEI） polyelectrolyte layer was firstly formed on a polyacrylonitrile（PAN） substrate.Copper（Ⅱ） ions were immobilized onto the PEI layer via two different approaches for the anti-biofou-ling membrane preparation,including static immersion and dynamic electro-deposition.Finally,a novel ultrafiltration membrane with Cu2＋ immobilization was obtained.The results indicated that both the PEI layer and Cu2＋ on the resulting membrane had relatively high stability.The rejection rate to humic acid of this membrane up to 99.0%,and this membrane also had an excellent bacteriostatic property,the bacteriostasis rate was 85.7%.In addition,compared to the static immersion method,dynamic electro-deposition method was a much more effective method for immobilizing Cu2＋,which could reduce the Cu2＋ immobilization time and significantly improve the immobilization efficiency.
出处
《高等学校化学学报》
SCIE
EI
CAS
CSCD
北大核心
2013年第3期739-745,共7页
Chemical Journal of Chinese Universities
基金
国家"九七三"计划项目(批准号:2009CB623402)
山东省优秀中青年科学家科研奖励基金(批准号:BS2012HZ016)
山东省科技发展计划项目(批准号:2012GGE29033)资助
关键词
超滤膜
聚乙烯亚胺
电沉积
铜固载
抑菌性
Ultrafiltration membrane
Polyethylenimine
Electro-deposition
Copper（Ⅱ） immobilization
Bacteriostasis
