摘要
基于导热模型分析了真空环境下使用陶瓷封装的铑铁温度计测量固体表面或内部温度的热响应时间,并进一步分析了在动态测温中,温度计的热响应时间对测量的影响。分析计算结果及实验表明,在动态测温中,热响应时间会使温度计测得的温度波动幅值小于被测温度,并且热响应时间越大,测得的温度波动幅值越小。
Thermal response time of ceramic packaging rhodium-iron thermometer was analyzed when used to measure the surface or inner temperature of solids in vacuum based heat conduction model. The influence of thermal response time on dynamic temperature measurement was analyzed too. The numerical simulation and experiment results show that the thermal response time causes a little amplitude of temperature oscillation in dynamic temperature measurement. Furthermore the larger thermal response time it is, the smaller amplitude becomes in measurement results.
出处
《低温工程》
CAS
CSCD
北大核心
2012年第6期33-36,共4页
Cryogenics
基金
中国科学院知识创新工程重要方向项目资助(YYYJ-1124)
关键词
铑铁温度计
热响应时间
动态测温
rhodium-iron thermometer
thermal response time
dynamic temperature measurement
