摘要
研究了电镀Ni层和化学镀Ni P合金层对Sn Ag/Cu焊点扩散行为的影响 ,电子探针分析表明 :化学镀Ni P合金层能很好地阻止Sn Ag/Cu焊点在焊接过程中的Cu ,Sn互扩散和相互反应 ;而电镀Ni层则不能阻止Sn Ag/Cu焊点在焊接过程中的Cu,Sn互扩散和相互反应 ,界面反应产物仍以Cu6 Sn5 为主。应用化学镀Ni P合金作为Sn Ag/Cu之间的扩散阻挡层可大大减少Sn/Cu金属间化合物的生成 。
The effects of electroplated Ni layer and electroless plated Ni P layer on the diffusion behavior in Sn Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni P layer acted as a good diffusion barrier between Sn Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter diffusion and reaction between molten Sn Ag solder and Cu substrate when reflowing, and there was a layer of IMC ( Cu 6Sn 5) at interface of Sn Ag/Cu solder joint. Electrolessly plated Ni P layer can obviously decrease the generation of Sn Cu IMC at the interface of Sn Ag/Cu, which is beneficial to improve the reliability of solder joint.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2000年第2期199-202,共4页
The Chinese Journal of Nonferrous Metals
关键词
扩散
电子器件封装
镍镀层
金属间化合物
钎焊
diffusion
electronic packing
nickel-plated layer
intermetallic compounds
