摘要
利用开路电位-时间(EOCP-t)曲线,研究铝表面经浸镍和化学预镀镍前处理后,化学沉积镍的初期行为;通过扫描电子显微镜(SEM)观察铝表面经前处理后的表面形貌.结果表明:未经及经前处理的铝表面,化学沉积镍的初期行为都经历去氧化膜、活化、混合控制以及化学沉积过程.经过浸镍和化学预镀镍前处理后的铝表面附着细小的镍颗粒.依据EOCP-t和SEM的最佳实验结果,在含有络合剂和还原剂的碱性预镀镍溶液中,经二次化学预镀镍前处理,成功实现铝基底弱酸性化学镀镍.所获得的化学镀镍层与铝基底结合牢固,呈团颗粒状形貌和非晶态结构.
The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential （OCP） as a function of time （Eocp-t）. Scanning electron microscopy （SEM） was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including Eocp-t and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
2012年第2期414-420,共7页
Acta Physico-Chimica Sinica
基金
国家自然科学基金(20873114,20833005,21021002)
国家重点基础研究发展规划项目(973)(2009CB930703)
福建省科技计划项目(2009H4020)资助~~
关键词
化学镀镍
铝
浸镍
化学预镀镍
开路电位
Electroless nickel plating
Aluminum
Nickel immersion
Electroless nickel pre-plating Open circuit potential
