摘要
采用化学镀的方法在室温下制得镀银铜粉。采用激光粒度测试仪、扫描电子显微镜、电阻测试仪测定粉体的性能指标。结果表明:采用该方法可以获得包覆完整的镀银铜粉,粉体电阻随镀层表面银的质量分数的增加而减小。采用球磨处理获得的片状粉体可以提高粉体的导电性,减少粉体的填充量。
The silver coated copper powders were prepared by electroless plating at room temperature.The powders were characterized using laser particle size analyzer,scanning electron microscopy and powder resistance test.The results show that by using this method,copper powders fully coated with silver can be obtained.The resistance of the powders decreases with the increasing of the mass fraction of silver on the coating surface.Flake-like powders obtained by ball milling can increase the conductivity of powders and reduce the filling mount of powder in condunctive adhesives.
出处
《电镀与环保》
CAS
CSCD
北大核心
2011年第6期26-28,共3页
Electroplating & Pollution Control
关键词
镀银铜粉
化学镀
导电性
silver-coated copper powder
electroless plating
conductivity
