摘要
为研究低熔点液态金属散热工质的强化散热机理,针对芯片散热,对热沉内低熔点液态金属镓以及水分别作为散热工质时的层流传热性能分别进行数值模拟,比较分析热沉流道长度、直径、Re数及工质导热系数对热沉散热性能的影响。结果表明,以镓为工质时,芯片温度受流道长度变化的影响较小,随流道直径、Re数的增加而降低;仅在流道长度小于临界长度的较短范围内具有比水更好的冷却效果,且临界长度随Re数的增加而增大;工质导热系数越大,芯片温度降低的程度越来越小。研究结果为合理设计液态金属散热系统提供理论基础。
In order to better understand the mechanisms of the cooling enhancement by the liquid metal based cooling technique,the heat transfer performances of the heat sink using liquid gallium and water as coolants for chip cooling are numerically simulated and compared to reveal the influences of channel length and diameter,Re and thermal conductivity on the heat dissipation rate.The results indicate that when liquid gallium is used as coolant,the chip temperature slightly changes with the channel length,and decreases with increasing channel diameter and Re.It is found that the critical length increases with Re,the cooling effect of liquid gallium is better than that of water only when the channel length is smaller than the critical length.It is also found that increasing the thermal conductivity can make the decrease extent of the chip temperature smaller.All the results provide the theoretical basis for better designing the cooling systems that use liquid metal as coolant.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2011年第14期146-150,共5页
Journal of Mechanical Engineering
基金
'十一五'信息对抗国防预研资助项目(41101050203)
关键词
液态金属
芯片冷却
传热性能
数值模拟
Liquid metal Chip cooling Heat transfer performance Numerical simulation
