摘要
为满足日益提高的半实物仿真实验对目标背景图像源的要求,研究了一种微加工工艺制得的光纤阵列结构的可见光/红外图像转换器。建立了利用二次辐射原理实现可见光/红外图像转换的光纤阵列面板的三维模型,利用有限元热力分析光纤阵列温度响应的最高温度和时间特性随加载热量的关系,实验中,单个光纤阵列端面加载热功率为5μW时,转换器实现温度响应的最高温度超过420K,温度响应的上升和下降时间达0.1ms。结果表明:相比薄膜形式转换器,该光纤阵列结构的可见光/红外图像转换器在机械强度、耐高温等方面的性能有所提高,可以为红外成像半实物仿真实验提供高温高帧频的背景图像源。
In order to satisfy the requirement of target background image resources in the hardware-in-the loop simulation test, fiber array plane for visible to infrared image transducer was researched. The 3D model based on the twice radiation principle was established. The relationship of the highest temperature and time property vs loaded heat quantity for fiber array temperature response were analyzed by finite element thermal analysis. Experimental results show the highest temperature can be more than 420 K when 5 p,W heat is loaded to the front side of single fiber, meanwhile the raising and falling time can be 0.1 ms. Compared with the Bly member, the property of the visible to infrared image transducer with the structure of fiber array is improved on mechanical strength, heat resistance etc. It can supply the background image resource with high temperature and frequency.
出处
《红外与激光工程》
EI
CSCD
北大核心
2011年第2期192-194,共3页
Infrared and Laser Engineering
基金
国防预研基金资助项目(BQ0185)
