摘要
超薄铜箔的生产大多采用具有一定厚度的载体箔作为阴极,在其上电沉积铜,形成超薄铜箔层.载体超薄铜箔生产的关键主要是解决载体与超薄铜箔剥离的问题,综述了载体超薄铜箔剥离层的研究现状,并对可剥离型超薄铜箔的发展作了展望.
The production of ultra-thin copper foil mainly uses carrier foil with a certain thickness as the cathode, with electro-deposition of copper on it. The key technology of the ultra-thin copper foil production is the peeling of the ultra-thin copper foil from the carrier. This paper summarizes the current researches on the peeling layer between the ultra-thin copper foil and the carrier. The prospect for the ultra-thin copper foil production is also predicted.
出处
《有色金属科学与工程》
CAS
2010年第6期22-24,38,共4页
Nonferrous Metals Science and Engineering
基金
国家科技支撑计划子项目(2007BAB22B00)
关键词
超薄铜箔
剥离层
无机层
有机层
ultra-thin copper foil
peeling layer
inorganic layer
organic layer
