摘要
本文应用最小能量原理和有限元方法建立由表面组装技术（ＳＭＴ：ＳｕｒｆａｃｅＭｏｕｎｔＴｅｃｈｎｏｌｏｇｙ）形成的焊点三维形态预测模型，并运用该模型对塑料球栅阵列（ＰＢＧＡ：ＰｌａｓｔｉｃＢａｌＧｒｉｄＡｒａｙ）器件焊点三维形态问题进行了预测和分析．最后将预测结果与试验结果以及国外学者用数学分析模型所得的预测结果进行了对比验证．
In this paper,minimal energy principle and finite element method were employed to develop solder joint shapes evolving model of PBGA.And three dimensional solder joint shapes of PBGA was predicted and analyzed.Comparisons were made between results predicted by the current model here and experimental measurements and those generated by mathematical analysis model at abroad.
出处
《电子学报》
EI
CAS
CSCD
北大核心
1999年第5期66-68,共3页
Acta Electronica Sinica
基金
电子部电科院预研基金
