摘要
研制了一种改性双马来酰亚胺树脂体系覆铜板(CCL),结果表明:制成的覆铜板具有玻璃化温度高、热膨胀系数小、模量高、介电常数低等优异的综合性能,可满足封装领域的技术需要,应用前景广阔。
A copper clad laminate（CCL） made of modified bismaleimide resin was studied.The results show that the CCL has good comprehensive properties of high glass transition temperature,ultra low coefficient of thermal expansion（CTE）,high modulus and low dielectric constant（Dk）,etc.The CCL has successfully been applied to IC substrate,which means a very promising prospect.
出处
《绝缘材料》
CAS
北大核心
2010年第5期11-13,共3页
Insulating Materials
基金
国家科技部支撑计划项目(2007BAE46B01)
关键词
双马来酰亚胺
覆铜板
IC封装
bismaleimide
copper clad laminate（CCL）
IC packaging
