摘要
以甲基三乙氧基硅烷为无机前驱体制取二氧化硅,并合成了二氧化硅改性热固性聚酰亚胺复合材料。利用美国Agilent4294A型精密介电频谱仪测定材料的介电常数(ε)和介质损耗因数(tanδ),用自制的耐电晕测试设备测试了耐电晕时间,采用CS2674C配套耐压测试仪测试了其介电强度,以及漆膜附着力。结果表明,随着无机二氧化硅掺杂量的增加,介电常数和介质损耗因数都呈上升趋势,介电强度均高于有机硅浸渍漆标准(JB/T 3078-1999);当二氧化硅掺杂4%时,耐电晕时间为36.8 h,是掺杂前的7.3倍,附着力良好,为一级。
Methyl triethoxysilane was used as inorganic precursor to prepare silica and composite materials of thermosetting PI modified by silica（SiO2/PI） were synthesized. The dielectric constants （ε） and dielectric loss（tanδ） of the composites were measured using dielectric spectrometer （Agilent4294A）; the corona-resistant life was tested with self-made equipment; and the breakdown strength and adhesion of the composites were measured, respectively. The results show that the dielectric constants and dielectric loss increase with the increase of silica content; and the breakdown strength is higher than the standard of JB/T 3078-1999. When the content of silica is 4wt%, the corona-resistant life is 36.8h and is 7.3 times higher than that of the pre-doping material; the adhesion of the composite material is in the first grade.
出处
《绝缘材料》
CAS
北大核心
2009年第5期41-44,共4页
Insulating Materials
基金
黑龙江省自然科学基金资助项目(E2007-33)
关键词
二氧化硅
热固性聚酰亚胺
介电性能
silica
thermosetting polyimide （PI）
dielectric properties
