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多面体低聚倍半硅氧烷/氰酸酯杂化树脂固化动力学与固化工艺研究 被引量:3

Study on the curing kinetics and curing process of cyanate ester/POSS hybrid resin
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摘要 采用非等温差示扫描量热法测试了不同升温速率下氰酸酯及氰酸酯/多面体低聚倍半硅氧烷(POSS)复合材料的固化过程,分析了不同升温速率下,POSS对树脂体系固化行为的影响。运用Kissinger法和Flynn-Wall-Ozawa法对杂化树脂固化反应活化能进行了计算。结果表明,POSS对氰酸酯树脂固化具有催化作用,能显著降低树脂固化温度,含10%POSS的杂化体系固化温度可降至212℃;两种不同模型计算的活化能分别为83.30kJ/mol和85.68kJ/mol,与纯氰酸酯相比,杂化树脂的固化活化能和反应级数均有所增大。 Curing process of cyanate ester (CE) resin and CE/ polyhedral oligomeric silsesquioxane (POSS) composites was measured by non-isothermal differential scanning calimetry at different scanning rates. The effect of POSS on the curing behavior of CE at different scanning rates was analyzed. The activation energy of hybrid system was calculated by Kissinger and Flynn-Wall-Ozawa methods. The results showed that the curing temperatures of cyanate ester resin decreased markedly because of the catalysis of POSS. The curing temperature of hybrid resin containing 10% of POSS can reduce to 212℃. The values of activation energy obtained from two different methods were 83.30kJ/mol and 85.68 kJ/mol, respectively. Compared with the pure CE resin, the activation energy and reaction order of hybrid resin increased slightly.
出处 《化工新型材料》 CAS CSCD 北大核心 2009年第6期89-92,共4页 New Chemical Materials
基金 江苏省高技术项目(BG2007047)
关键词 多面体低聚倍半硅氧烷 氰酸酯 固化动力学 差示扫描量热法 polyhedral oligomeric silsesquioxane(POSS), cyanate ester, curing kinetics, DSC
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参考文献9

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