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非氰试剂从废印刷线路板中浸金进展 被引量:5

Review on Gold Leaching from PCB with Non-cyanide Leach Reagents
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摘要 依据金浸出原理综述研究最为广泛的非氰浸金剂如硫脲、硫代硫酸盐、硫氰酸盐等,并介绍相应的操作条件、矿石适应性和浸金结果及完善措施。 The most widely-researched non-cyanide lixiviant systems for the gold recovery such as thiourea, thiosulphate, thiocyanate etc. are reviewed according to the gold leaching reactions, and the relative operating parameters, ore flexibility, leaching performance and improving measures are described.
出处 《有色金属》 CSCD 北大核心 2009年第1期72-76,共5页 Nonferrous Metals
基金 上海市科技发展基金资助项目(042312006)
关键词 冶金技术 非氰浸金剂 综述 废印刷线路板 硫脲 硫代硫酸盐 硫氰酸盐 metallurgical technology non-cyanide leaching reagent review PCB thiourea thiosulphate thiocyanate
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参考文献37

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二级参考文献1

  • 1[5]Shunli Zhang.Waste Management&Research,1998,16(2):119~128

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