摘要
针对微型电子设备热失效问题,对14.4 mm3体积内,热密度为150W/cm2的电子设备液体冷却系统进行了研究。通过理论计算分析得出微小结构液体冷却系统槽道肋板高度的最佳值,解决了发热器件在许可温度下正常工作的问题。试验结果证明,水力直径为0.5 mm的该液体冷却系统槽道在层流状态下的理论计算是正确的,得到了宏观传热理论对这个尺度的分析将不受尺度效应的影响。
The thermal failure problem is quite concerned in the micromation of electronic equipment. A liquid cooling system was researched,which was 14. 4 mm^3 in volume and the heat flux density was 150 W/cm^2 ,and the problem of heater＇s normal working under allowance temperature was solved. Through theoretical analysis, the optimal value of rib height in the cooling system is gained, and theoretical analysis is proved to be right in laminar flow by the experimental results. When the equivalent diameter is 0. 5 mm, the macroscopic heat transfer theory is not affected by the scale effect.
出处
《金属热处理》
CAS
CSCD
北大核心
2008年第12期86-88,共3页
Heat Treatment of Metals
基金
国家"十一.五"预研项目(51318020312)
关键词
电子设备
热失效
液体冷却
electronic equipment
thermal failure
liquid cooling
