摘要
介绍了含SiH基与芳烷基的MQ硅树脂作交联剂的苯基硅树脂封装料、含2官能硅氧烷链段的硅树脂封装料及透镜材料、加成型液体苯基硅橡胶封装料、紫外光固化型硅树脂封装料的主要成分及配制等。
The main ingredients and preparation of silicone materials for LED packaging were introduced in details. They included phenyl silicone resin packaging materials made of Sill-containing alkyl of MQ silicone resin as cross-linking agent, silicone resin packaging materials with 2 functional siloxane chains, and the lens material, liquid phenyl silicone rubber packaging material, as well as UV cured silicone resin packaging materials.
出处
《有机硅材料》
CAS
2008年第6期382-388,共7页
Silicone Material
关键词
发光二极管
有机硅
环氧树脂
封装
light-emitting diodes, silicone, epoxy resin, packaging
