摘要
本文实验研究了磁感应强度、研抛压力、加工速度及加工时间等几个加工参数对集群磁流变效应微磨头平面研抛加工效果的影响。实验结果发现,随着磁感应强度的增强,材料去除率增大,而表面粗糙度略有提高;研抛压力及加工速度与材料去除率成正比,表面粗糙度随加工速度的提高逐渐变大,而随着研抛压力的增大先降低后增加,当压力为6898 Pa时到达最小;随着加工时间的增加,材料去除量线性增大,而粗糙度先迅速降低后逐渐趋于稳定。在此基础上,提出了集群磁流变效应微磨头平面研抛加工的材料去除模型,其加工特征介于游离磨料研磨抛光和固着磨料研磨抛光之间,是一种全新的平面研抛加工技术,有着较好的应用前景。
Experiments were conducted to reveal the influence of some process parameters, such as the intensity of magnetic field, the polishing pressure, the rotation speed and the polishing time, on the polishing properties of the instantaneous tiny-grinding wheel cluster based on magnetorheological （MR） effect in this paper. Experimental results indicate the following conclusions： with the increase of the intensity of magnetic field, the material removal rate increases gradually while the surface roughness deteriorates slightly; the polishing pressure and the rotation speed are proportional to the material removal rate, but the surface roughness increases gradually with the increase of rotation speed, while it decreases firstly and then increases with the enhancement of polishing pressure, the optimal values of the polishing pressure is 6 898 Pa; the polishing time is proportional to the material removal, with the increase of polishing time, the surface roughness of the workpiece decreases rapidly, then tends gradually to a stable value. Furthermore, the material removal model of the planarization technique was presented, and the polishing effect of the planarization technique combines their advantages of the abrasive-embedded polishing and the dissociative abrasive particles polishing. The novel planarization polishing technique can be expected to have a wide application prospect.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2008年第5期66-70,共5页
Diamond & Abrasives Engineering
基金
国家自然科学基金(50575045)
教育部科学技术研究重点项目(208102)
高等学校博士点学科专项科研基金(20060562005)资助
关键词
集群微磨头
磁流变效应
平面研抛
材料去除模型
tiny-grinding wheel cluster
magnetorheological effect
planarization polishing
material removal model
