摘要
利用基于X射线所采集的图像检测BGA器件焊点在PCB板上所存在的缺陷.介绍了采用基于X射线焊点图像的检测方法,讨论了缺陷检测算法的实现过程,提出了焊点粗糙度的概念和计算方法,最后给出了实验结果,结果表明提出的检测方法在BGA焊点的缺陷检测中是有效的.
This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging. Discusses the flow of detecting defects based on the X-ray imaging and describe an approach to automatic inspection of BGA solder joint defects by using seed filling and contour extracting. Experimental results reveal that the proposed method shows practical usefulness in BGA solder joint inspection.
出处
《哈尔滨商业大学学报（自然科学版）》
CAS
2008年第3期355-357,362,共4页
Journal of Harbin University of Commerce：Natural Sciences Edition
基金
黑龙江省青年科学技术专项资金项目(QC06C046QC07C12)
关键词
BGA
X射线
PCB
焊点
ball grid array
X-ray
PCB
Solder joints
