摘要
观察了低温烧结型银基浆料烧结膜的表面形貌,比较了有机载体含量对浆料烧结膜孔洞率的影响,分析了单一溶剂及混合溶剂有机载体所配浆料的TGA曲线。结果表明:采用混合溶剂可将浆料烧结膜的孔洞率从49.5%降低到21.6%。随着有机载体含量的增加,浆料烧结膜孔洞率增大。当w(有机载体)为21%时浆料可获得较佳的综合性能。
Surface morphology of sintered film of low temperature sintered silver base paste was observed. The influence of organic vehicle with different proportion on the void rate of sintered film was compared. The TGA curves of pastes prepared with single solvent and mixed solvent organic vehicles were analysed. Result shows that the application of mixed solvent can decreases the void rate from 49.5% to 21.6%. The void rate of the sinterd film increases along with the increasement of organic vihicle content, when w（organic vehicle） is 21%, the paste can obtain better overall performances.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第6期18-21,共4页
Electronic Components And Materials
基金
国防科工委资助项目
关键词
电子技术
低温烧结型银基浆料
有机载体
孔洞率
electron technology
low-temperature sintered silver base paste
organic vehicle
void rate
