摘要
利用超声波辅助化学镀法在桦木单板表面沉积Ni-P合金镀层。以镀后单板的电磁屏蔽效能为指标,研究100W超声波辅助下施镀温度和施镀时间的影响,对比0、100和250W超声波辅助的影响。同时,利用X-射线衍射、扫描电镜和能量分散色谱分析超声波功率与镀层的组织结构、表面形貌和P含量的关系。利用直拉法测定0和100W超声波辅助化学镀所沉积镀层的结合强度。结果表明:施镀温度较低时,超声波的辅助作用更加明显;100W超声波辅助,施镀温度62℃,施镀时间20min,镀后桦木单板在9kHz^1.5GHz频段,电磁屏蔽效能达到60dB;较无超声波辅助降低了温度,缩短了时间;超声波辅助使镀层中的P含量随功率的增加而增加,均匀性变差,但晶态结构未改变;无论有无超声波辅助,桦木表面所沉积的镀层均具有很高的结合强度;过高功率的超声波辅助对化学镀过程是不利的,综合分析认为100W最为适宜。
Ni-P alloy was deposited on the surface of birch veneer by using ultrasound-assisted electroless plating method. Electromagnetic shielding effectivness（ESE） of plated birch veneer was used as index to discuss plating temperature and time under 100 W ultrasonic irradiation, and compare the effect of ultrasound power of 0, 100 and 250 W. At the same time, the relationships of microstructure of the layer, surface morphology and P content to ultrasound power were investigated by X-ray diffraction（XRD）, scanning electron microscopy（ SEM） and energy dispersion spectrum（EDS）= Bonding strength of the layers deposited under 0 and 100 W ultrasonic irradiation was measured by vertical pulling method. The results show that the effect of ultrasonic irradiation is more obvious when plating temperature is lower. The ESE plated birch veneer under 62 ℃for 20 min under 100 W ultrasonic irradiation is up to 60 dB in the frequencies from 9 kHz to 1.5 GHz. Ultrasound-assisted electroless plating needs lower temperature and less time than conventional electroless plating. Ultrasonic irradiation makes P content increase and surface morphology un-uniform. However, the layers deposited under ultrasonic irradiation are still crystalline. High bonding strength exists between the layer and wood surface no matter ultrasound-assisted or not. Excessively high power ultrasonic irradiation is disadvantageous for electroless plating. 100 W ultrasonic irradiation is feasible after comprehensive analysis.
出处
《林业科学》
EI
CAS
CSCD
北大核心
2007年第12期112-116,共5页
Scientia Silvae Sinicae
基金
国家自然科学基金资助项目(30571454)
关键词
超声波辅助
桦木单板
化学镀
Ni—P合金
电磁屏蔽
ultrasound-assisted
birch veneer
electroless plating
Ni-P alloy
electromagnetic shielding effectivness
