摘要
传统分离脆性材料的技术由于易产生残余应力、显微裂纹与边部碎屑等缺陷,越来越不能满足半导体工业高精度与高清洁度的要求。激光微细加工技术以无污染、无接触及加工精度高、操作柔性好等优势,正成为一种很有潜力的脆性材料精密加工技术。介绍了用于分离脆性材料的几种典型激光微细加工技术,包括激光烧蚀切割技术、激光诱导张应力控制微裂纹扩展技术与激光剥离技术的工艺原理、特点及研究现状,指出了其存在的主要问题并探讨了其改进措施。最后预测了激光分离技术的发展前景。
The traditional separation techniques of brittle materials can not meet the high precision and high cleanliness requirements in the semiconductor industry because they are susceptible to some flaws, such as residual stress, micro-cracks, chippings on the edge. However, the laser micro-processing technique is becoming a potential precision processing technique for brittle materials because of its advantages, such as non-pollution, non-contact, high processing precision and operational flexibility. The principle of processing, characteristic and research status on the several typical laser micro-processing techniques, such as laser ablation cutting technique, micro-crack propagation control technique by laser-induced tension, laser lift-off technique used to separate brittle materials are reviewed. The main problems existing in the techniques are pointed out and the improvements are briefly discussed. The development prospect of laser separation techniques is also predicted.
出处
《应用光学》
CAS
CSCD
2007年第3期321-327,共7页
Journal of Applied Optics
关键词
激光微细加工
激光烧蚀切割
微裂纹扩展控制
激光剥离
脆性材料
laser micro-processing
laser ablation cutting
micro-crack propagation control
laser lift-off
brittle material
