摘要
介绍了聚酰亚胺(PI)作为硅双极型大功率开关器件芯片制造阶段表面钝化膜的工艺技术,该钝化工艺的工艺简单、成本低且能与普通的硅平面制造工艺兼容。实验表明,该工艺的使用能提高器件的可靠性,降低生产成本。
Author introduces a process technology that the Polyimide（PI） is used as the surface passivating of the Si bipolar high-power devices about chip madding phase. The process has the advantages of simple process, costing cheaply and being compatible with the common fiat madding process. Experiments shows the process can improve the reliability of devices and reduce the cost of production.
出处
《贵州大学学报（自然科学版）》
2007年第1期90-93,共4页
Journal of Guizhou University:Natural Sciences
关键词
聚酰亚胺
表面钝化
化学腐蚀
亚胺化
Polyimide（ PI）, surface passivating, chemical corrosion, imidization
