期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

基于QFP技术的高频集成电路封装设计 被引量：3

High Frequency IC Package Design Based on QFP Lead Frame
在线阅读 下载PDF
导出
摘要 通过对标准QFP引线框架的改造,实现了一种高频集成电路芯片的封装设计。介绍了利用电磁场仿真软件进行封装的3D建模,并提取封装结构的模型参数,进行信号完整性分析的方法。实例验证表明,此方法以较低的封装成本,较好地减少了长键合线及框架引脚对高频信号的影响,在现有的封装技术基础上提供了实现高频/高速集成电路封装的新思路。 By modified the leadframe of standard Quad Flat-Packs, a packaging design for high frequency IC was completed. The package 3D model created by electromagnetic simulation software was introduced and the method about how to extract the model＇s parameters for signal analyzing was presented. The simulation results show that this method greatly reduced the effect of long bondwires and leaders at lower cost. It gives a novel packaging method for high frequency IC based on packaging technology at present.
作者 孙海燕 景为平 孙玲
机构地区 东南大学集成电路学院 南通大学专用集成电路设计重点实验室
出处 《电子元件与材料》 CAS CSCD 北大核心 2006年第12期47-50,共4页 Electronic Components And Materials
基金 江苏省高技术资助项目(BG2005022) 新型显示技术及应用集成教育部重点实验室开放课题资助项目(NO.P200504) 南通大学自然科学基金资助项目(05Z114)
关键词 半导体技术 集成电路封装 QFP 信号完整性 建模 semiconductor technology integrated circuit package QFP signal integrity modeling
分类号 TN402 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献6

  • 1Tsal C T. Signal integrity analysis of high-speed, high-pin-count digital packages [A]. IEEE Electronic Components and Technology Conference,Proceedings 40^th [C]. 1990.
  • 2Tatsuya Hirose. High-frequency IC packaging technologies [A]. IEEE Indium Phosphide and Related Materials International Conference [C].2003.
  • 3Jing W P, Wu X C, Sun L. An application of MCM technology [A]. IEEE.6th International Conference on Electronic Packaging Technology [C].2005.
  • 4Jain Nirmal, John Silvestro, Zoltan Cendes. SI issues associated with high speed packages [A], IEEE IEEOCPMT Electronic Packaging Technology Conference [C], 1997.
  • 5Albert Chee W Lu, Wei Fan, Lai L Wai. Modeling and characterization of wire bonding for RF application [A]. IEEE Electronic Components and Technology Conference [C], 2002.
  • 6Khouzema B Unchwaniwala, Michael F Caggiano. Electrical analysis ofIC packaging with emphasis on different ball grid array packages [A].IEEE Electronic Components and technology Conference [C], 2001.

同被引文献17

  • 1石明达,吴晓纯.低成本的MCM和MCM封装技术[J].中国集成电路,2004,13(10):41-44. 被引量：4
  • 2Hongyu Zheng; Ling Gao; Zhiping Liu. Progress in development of advanced package for semiconductor device [J],Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on, Volume: 1 , 22-25 Oct. 2001 Pages:83 - 87 vol. 1.
  • 3Hirose, T. High-Frequency IC Packaging Technologies [C]. IEEE Indium Phosphide and Related Materials, 2003, 227 - 230.
  • 4Tzyy-ShengHorng, Sung-MaoWu, Hui-Hsiang Huang, etal. Modeling of Lead-Frame Plastic CSPs for Accurate Prediction of Their Low-Pass Filter Effects on RFICs [C]. IEEE Radio Frequency Integrated Circuits Symposium, 2001, 133-136.
  • 5Y.-L. Lai, C.-Y. Ho. RF modeling of ball grid array packages using electromagnetic approaches [C]. Proc. 10th Int. Syrup. on Integrated Circuits, Devices and Systems, Singapore, 2004.
  • 6Hirose T. High-Frequency IC Packaging Technologies [C]. IEEE Indium Phosphide and Related Materials, 2003, 227- 230.
  • 7Tzyy-Sheng Horng, Sung-Mao Wu, Hui-Hsiang Huang, et al. Modeling of Lead-Frame Plastic CSPs for Accurate Prediction of Their Low-Pass Filter Effects on RFICs [C]. IEEE Radio Frequency Integrated Circuits Symposium, 2001, 133-136.
  • 8A Pham, C Chun, J Laskar, et al. Surface mount microwave package characterization technique[C]. IEEE Intl Microwave Symp. MTT-S, 1997, 2:995-998.
  • 9D Jessie, L E Larson. Improved techniques for the measurement and modeling of plastic surface mount packages to 20 GHz [C]. IEEE Radio and Wireless Conference (RAWCON) , 2000, 243-246.
  • 10Y L Lai, C Y Ho. RF modeling of ball grid array packages using electromagnetic approaches [C]. Proc. 10th Int.Symp. on Integrated Circuits, Devices and Systems, Singapore, 2004.

引证文献3

二级引证文献2

电子元件与材料
2006年 第12期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部