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采用全对称测试结构的超薄单晶硅薄膜热导率测量 被引量:1

Measurement of Thermal Conductivity of Ultra-Thin Single Crystal Silicon Film Using Symmetric Structure
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摘要 改进了传统稳态加热法的测试结构,设计了带隔离槽的全对称悬空薄膜测试结构,并使用有限元工具对测试结构进行了优化.测量了室温下50和80nm厚度的单晶硅薄膜的横向热导率,分别为32和38W/(m.K),其相对体硅热导率(148W/(m.K))有明显下降,实验结果与BTE(Boltzmann transport equation)的理论预测曲线吻合得很好. The traditional steady-state joule heating method is improved by inducing a symmetric structure,and a thermal isolation trench is added in suspended Si membrane. The novel measurement structure is optimized using ANSYS tools. A large reduction in thermal conductivity resulting from phonon boundary scattering is observed. The lateral thermal conductivity of the 50nm and 80nm Si films at a temperature of 293K are measured to 32 and 38W/(m · K), respectively, which, compared to the bulk value of 148W/(m · K),agree well with the prediction of the BTE equation.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第11期1961-1965,共5页 半导体学报(英文版)
基金 国家重点基础研究发展规划资助项目(批准号:G2000036501)~~
关键词 超薄单晶硅薄膜 热导率 稳态加热法 ultra-thin single crystal layer thermal conductivity steady-state joule heating
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