摘要
钨铜复合材料作为一种用途广泛的粉末冶金材料受到了普遍关注。钨铜复合材料具有良好的耐电弧浸、抗熔焊性和高强度、高硬度等优点,目前被广泛地用作电触头材料、电极材料、电热合金、喉衬材料等。本文分析了铜相纯度对钨铜复合材料电阻率、硬度的影响,并对如何改善钨铜复合材料的微观组织等问题进行讨论。实验研究表明:随着铜相纯度的提高,材料的硬度降低、电阻率减小。
W-Cu compound material is universally conceived as powder metallurgy material, it has virtues such as resistance of electric arc erosion, fusion welding-resistant, hight intensity and hardness. At the moment, it is used widly to produce electric contect material, electrode material, electric-thermal alloy,high density alloy and so on. Purification of Cu phase＂ s effection on W-Cu alloy＂ s resistivity and hardenss are analyzed in this paper. At the same time, some questions such as improving W-Cu alloy＂ s micro-structure are discussed.Based on this experiment, it indicates when purification of Cu phase is increased, hardness and resistivity reduce.
出处
《中国钨业》
CAS
北大核心
2006年第3期34-36,共3页
China Tungsten Industry
关键词
W-CU复合材料
硬度
电阻率
Cu相纯度
断口分析
W-Cu compound material
hardness
resistivity
purification of Cu phase
fracture analyzing
