摘要
随着计算机硬盘容量的增大、转速的提高、磁头与盘片间距离的降低,对硬盘基板材料选择及改善基板表面平整度提出了更高的要求。综述了硬盘基板材料的发展状况,指出了基板化学机械抛光(CMP)中亟待解决的问题和解决的途径,分析研究了影响硬盘基板CMP技术的因素及如何控制基板抛光后的表面质量。
With the increasing capacity of hard disk of computer, the rotational increasing speed, the distance between the magnetic head and substrate lower, higher requirements were set for chips of hard disk to choose materials and increase the formation of surface. An overview of development about chips material for hard disk was provided, the questions which were solved urgently in the CMP process of chips were pointed out. The influencing factors of chips CMP technology on hard disk were analyzed, and the method for controlling the finishing surface of substrate after CMP was researched.
出处
《半导体技术》
CAS
CSCD
北大核心
2006年第8期565-568,共4页
Semiconductor Technology
基金
天津市自然科学基金科技发展计划项目(043801211)
