摘要
选用Cu,Nb,Mo箔中间层,在特定的焊接参数条件下对Ti(C,N)基金属陶瓷/40Cr钢接头进行了钎焊试验,分析比较了中间层与钎料的不同匹配对抑制裂纹形核及扩展的影响。结果表明,中间层Cu能有效释放接头残余应力,防止接头产生裂纹;中间层Nb易溶解并聚集成带状,并在该带状组织与钎缝界面萌生裂纹;中间层Mo的减应效果较差。影响Ti(C,N)基金属陶瓷/40Cr钢钎焊接头残余应力的因素很多,应综合考虑各因素才能达到有效降低接头应力的目的。
In the paper using pure Cu,Nb and Mo foil with specific technical parameters,a series of tests are investigated to braze Ti(C,N)based ceramal to and 40 Cr steel.The effects are analyzed,on which the different matching of interlay and solder has restraining crackle from nucleation and expansion.The results show that interlayer Cu can effectively make brazed joint release residual stress and prevent joint from crackle.Interlayer Nb easily dissolve and gather into banding,and the crackle initiates in the interface of this banded structure and soldering seam.Interlayer Mo has a poorer effectiveness in the way of reducing stress.There are many factors that have an impact on residual stress of brazed joint,so all factors should be considered to effectively reduce residual stress.
出处
《焊接技术》
北大核心
2006年第3期18-19,共2页
Welding Technology
基金
江苏省教育厅自然科学基金资助项目(05KJB460029)
