摘要
介绍了一种新型的塑料表面金属化方法——磁控溅射法在电磁屏蔽上的应用,研究了工艺过程和工艺条件对镀层厚度、附着力和屏蔽性能的影响。结果表明,工作电压、放电电流,充氩气前后的真空度和基片温度影响镀层质量。在真空度达到2Pa(0.015torr)时,通入氩气直到压力达到40～20Pa,在阴极工作电压-500V,阳极放电电流0.7A时,可提高膜层的附着强度。采用间歇溅射可避免塑料制件的热变形,PP和HIPS每次溅射时间4min,ABS每次溅射时间5～6min,当镀层达到所需厚度时,在2Pa真空度下冷却30min,可进一步提高镀层附着力,达到一级附着力水平。当铜层厚度达到1.0～4.0μm时,电磁屏蔽作用可达80～110dB,达到美国FCC和德国VDE标准,铜表面镀镍可提高镀层的耐磨和耐蚀性。
The application of a new technology of metal plating,magnetic sputtering, to electromagnetic shielding is described in this paper. The effect of the process and processing conditions on the thickness, adhesive force and shielding property of the plating was studied. The results showed the operation voltage, discharging current, the vacuum before and after argon-filling and the temperature of the base film all had effects on the quality of the plating. The adhesive force of the plating could be increased by filling with argon from the vacuum 2 Pa (0. 015 torr) to 40～20 Pa, with an cathode operative voltage -500V, anodic discharging current 0. 7A. The thermal deformation of plastics product could be avoided by means of discontinuous sputtering. The sputtering time for PP and HIPS was 4 min, and 5～6 min for ABS. The adhesive force of the plating could be further increased by means of cooling for 30 min at vacuum 2 Pa when the targeted thickness of the plating was achieved, coming up to A grade of adhesive force. The electromagnetic shielding could be 80～110 dB when the Cu plating thickness was up to 1. 0～4. 0 μm,coming up to FCC standard of USA and VDE standard of German. The wear resistance and corrosion resistance of the plating could be improved by Ni plating on Cu plating.
出处
《塑料工业》
CAS
CSCD
北大核心
1996年第3期95-97,共3页
China Plastics Industry
