摘要
研究用合金化Ag-Cu-Ti粉、Ti粉、C粉组成的混合粉末真空无压钎焊再结晶SiC陶瓷和Ti合金,采用X射线衍射、扫描电镜和能谱仪对接头的组织结构进行了分析.结果表明:在67.6%Ag-26.4%Cu-6%Ti(质量分数)粉末中加入相当于15%～30%TiC(体积分数)的(Ti+C)粉末(Ti与C摩尔比为1:1),经920℃,30 min真空钎焊,Ti和C原位合成TiC,形成以TiC晶粒强化的连接良好的复合接头;形成的TiC分布于Ag相、Cu-Ti相中;TiC的形成明显降低了接头的热应力.过量的(Ti+C)粉末则导致反应不完全,容易在连接层中产生孔洞,影响接头强度;焊接过程中,Ti由钛合金扩散进入连接层,Cu也有部分从连接层中扩散进入钛合金.
By using the mixed powder of Ti, C （mole ratio of Ti to C is 1 ： 1） powders for in-situ synthesizing TiC in 15 %- 30 % TiC （volume fraction） and alloying 67. 6 % Ag-26. 4 % Cu-6 % Ti （ mass fraction） powder as vacuum non-pressure brazing material, sound brazed joints of SiC ceramics/Ti alloy were acquired at 920 ℃ for 30 min. The joints were investigated by X-ray diffractrometry, scanning electron microscopy, and energy dispersive spectrometry. The results show that TiC grains are in-situ synthesized and distribute in Ag and Cu-Ti phases of the bonding layers, distinctly lowering the thermal stress of the joints. However, excess amount of （Ti ＋ C） powder easily brings about the formation of pores and incomplete reactions of Ti and C in the bonding layers, which are detrimental to the joints＇ strengths. During brazing process, Ti element in Ti-alloy and Cu element in the bonding layer interdiffuse.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2005年第9期1326-1331,共6页
The Chinese Journal of Nonferrous Metals
基金
武器装备预研基金资助项目(51418050503QT0203)
高等学校博士学科点专项科研基金资助项目(20030008014)
