摘要
简述了高强度导电铜基材料的设计思路,分析了时效强化、颗粒强化以及形变复合等3类铜基材料的制备方法和特点,综述了高强度导电铜基材料的研究现状,并展望了其进一步发展的趋势。
Design consideration of high-strength and high-conductivity copper-matrix material is de- scribed.Fabrication process and property characters of copper-matrix materials,typed as aging strengthening,disper- sion strengthening and deformation processed composite materials are analyzed.The present research and development prospect are reviewed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第7期8-11,共4页
Materials Reports
基金
国防科技重点实验室基金(00JS61.6.1.HT0103)
