摘要
本文借助于热辐射应力图像分析技术对裂纹尖端附近的应力场进行分析测定。记录了铝质紧凑拉伸试件的热辐射应力图像,给出裂纹尖端前沿的温度变化曲线。根据热弹效应和线弹性断裂力学理论,通过解析建立用热辐射应力图像分析技术确定Ⅰ型裂纹应力强度因子的基本方程。在此基础上,用热辐射应力图像分析技术实验确定Ⅰ型裂纹应力强度因子和裂尖塑性区。
In this paper, the stress field around crack tip in compact tension specimens made of aluminum alloy has been measured. The thermal emission stress patterns and curves of variances in temperature in front of the crack tip are obtained. From thermoelastic effect and linear elastic fracture mechanics, the fundamental equations applied to determing SIF K using SPATE are established herein. Based on this analysis, it has been shown experimentally that the SIF K_I and plastic region near crack tip can be determined by SPATE.
出处
《同济大学学报（自然科学版）》
EI
CAS
CSCD
1993年第4期469-475,共7页
Journal of Tongji University:Natural Science
基金
国家自然科学基金
关键词
热辐射应力
图像
热弹性
强度因子
Experimental stress analysis
SPATE
Thermoelasticity
SIF
Plastic region
