摘要
以亚微米级(130nm)碳化硅颗粒(SiCp)和微米级(10μm)Cu粉为原料,采用冷压烧结和热挤压方法制备出SiCp/Cu基复合材料,研究其SiCp含量对SiCp/Cu基复合材料电学、力学和摩擦学性能的影响。结果表明:当SiCp体积含量从0.5%增高到5.0%时,电导率从96.2%IACS下降到87.4%IACS,维氏硬度从64.8MPa增高到87.8MPa,抗拉强度从213.3MPa增大到217.3MPa,伸长率从41.5%下降到8.6%;SiCp/Cu基复合材料具有优良的摩擦学性能,0.5%SiCp/Cu基复合材料和5.0%SiCp/Cu基复合材料的磨损质量损失在载荷为300～1200N时分别仅是工业供应态T3铜的1/4.07～1/1.13和1/14.25～1/2.10,亚表层疲劳裂纹引发的疲劳磨损是SiCp/Cu基复合材料的磨损机理之一,磨损表面和亚表面没有明显的来自对磨钢的Fe元素。
Submicron SiC_p/Cu matrix materials were fabricated by powder metallurgy, using micron Cu and submicron SiCp (130nm) as the raw materials. The resulting materials were hot extruded to get rid of the possible void and increase compactness.The influence of submicron SiC_p content on electrical conductivity, Vickers hardness, ultimate tensile strength, elongation to failure and sliding wear-resistance, of submicron SiC_p/Cu matrix composites, were investigated.The results show that when the volume fraction of SiC_p increases from 0.5vol.% to 5.0vol.%, the electrical conductivity decreases from 96.2%IACS to 87.4%IACS, the Vickers hardness increases from 64.8MPa to (87.8)MPa, the ultimate tensile strength increases from 213.3 MPa to 217.3MPa and the elongation to failure decreases from 41.5% to 8.6%.The submicron SiC_p/Cu matrix composites exhibit excellent tribological properties. The wear mass loss of the 0.5vol. % SiC_p/Cu matrix composites and the 5.0vol. % SiC_p/Cu matrix composites are only 1/4.07～1/1.13 and 1/14.25～1/2.1 of that of commercially available T3 pure copper under the load of 300～1200N, respectively. The fatigue wear resulting from subsurface fatigue cracking is the main worn mechanism of the submicron SiC_p/Cu matrix composites. No obvious counterpart steel wear debris transfer is observed in the worn surface and subsurface of the submicron SiC_p/Cu matrix composites.
出处
《热加工工艺》
CSCD
北大核心
2004年第11期24-26,共3页
Hot Working Technology
