摘要
利用扫描电子显微镜和差热分析仪,研究了Sn-0.7Cu粉末的机械合金化过程;同时将机械合金化获得的粉末制成焊膏,进行铺展实验,并对金相组织进行了分析。研究结果表明,机械合金化是一种制备钎料粉体的方法;粉末的最终颗粒尺寸可通过合适的工艺参数来控制;用机械合金化获得的钎料粉体制成的焊膏,其铺展面积及润湿角方面与传统的熔炼法获得的钎料差别不大,铺展试样的金相组织由富Sn相、Cu6Sn5和少量Cu3Sn相组成。
Sn-0.7Cu powder prepared by mechanical alloying (MA) was analyzed using a differential thermal analyzer (DTA) and a scanning electron microscope (SEM). The microstructure of Sn-0.7Cu solder paste made from MA powder was analyzed after spreading experiment. The results show that MA is one of the methods to prepare solder alloys. The size of particles depends on the MA parameters. There was no distinct difference in spreading area and wetting angle between MA paste and cast solder. The microstructure was composed of Sn-rich phase, Cu_6Sn_5 and Cu_3Sn phase IMCs.
出处
《电子工艺技术》
2004年第6期239-242,共4页
Electronics Process Technology
基金
863项目(No.2002AA322040)
北京科委项目(No.05009012200201)。
