摘要
采用熔体快淬法制备了CuCr25(%,质量分数)合金带,将合金中的Cr粒子尺寸细化到了200 nm以下,并通过控制时效在Cu基体中得到了尺寸小于30 nm的Cr共格沉淀。用高真空电弧观测平台对所得试样进行的电击穿测试表明,在小击穿电流(峰值为10 A)条件下,熔体快淬CuCr25合金的平均截流值为1.59 A。不仅比粉末冶金粗晶CuCr25触头材料降低了约50%,而且明显低于Cr粒子尺寸约为50 nm的粉末冶金纳晶触头材料。分析了溶体快淬CuCr25合金的微观组织对其截流值和真空电弧稳定性的影响,并指出熔体快淬法是提高触头材料综合性能的一种有效手段。
CuCr25(%,mass fraction) ribbons were prepared by melt spinning.The Cr particles in the ribbons were refined to less than 200 nm and the coherent Cr precipitations were obtained by controlling annealing.The discharging experiments were performed in a high vacuum chamber at a current of 10 A.The results indicate that the mean chopping current of melt-spun CuCr25 ribbons is 1.59 A,which is about 50% of sintered CuCr25 contact material with coarse grains and obvious lower than that of sintered CuCr25 with nano grains(the size of Cr phase is about 50 nm).The effects of the microstructures of melt-spun CuCr25 alloy on the chopping current and arc stability were discussed.It is predicted that melt spinning can be an adopted method to improve the electric properties of contact materials.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2006年第z2期93-96,共4页
Chinese Journal of Rare Metals
基金
国家自然科学基金资助项目(50371066)
