摘要
为了解决BGA芯片视觉检测任务中,对存在焊点缺失的BGA图像进行位姿信息获取和焊点理论中心计算的问题,分析了现有点模式匹配算法的不足,提出了改进的点模式匹配算法。该算法基于BGA焊点的排列规律,建立了焊点分布矩阵模型,并应用度量空间展开网格,通过仿射变换映射到图像空间中,以网格为线索确定匹配关系,最后使用点集配准完成精确计算,得到位姿信息和焊点理论中心。通过模拟仿真实验,证明了该方法可以适应焊点缺失的情况,定位误差在1.6%,精确度比传统方法提升了26.4%。
Aimed at solving the problem about obtaining pose information and calculating the theoretical center of solder joints for BGA images with missing solder joints in the task of BGA chip visual inspection,an improved point pattern matching algorithm was proposed after analyzing the deficiency of the existing point pattern matching algorithm.The algorithm establishes a solder joint distribution matrix model base on the arrangement of BGA solder joints,and uses the metric space to expand the grid,maps it to the image space through affine transformation,uses the grid as a clue to determine the matching relationship,and finally uses the point set registration to complete accurate calculation,get the pose information and the theoretical center of the solder joint.Through simulation experiments,it is proved that the method can adapt to the situation of missing solder joints.The position error is 1.6%and the accuracy is improved by 26.4%compared with the traditional method.
作者
罗明亮
曾祥进
Luo Mingliang;Zeng Xiangjin(School of Computer Science and Engineering,Wuhan Institute of Technology,Wuhan 430205,China)
出处
《电子测量技术》
北大核心
2021年第7期82-87,共6页
Electronic Measurement Technology
基金
国家自然科学基金项目(61502355)
湖北省教育厅重点研究项目(D20171503)资助
关键词
球栅阵列
度量空间
点集匹配
点集配准
仿射变换
BGA
grid template
point set matching
point set registration
affine transformation
