High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensi...High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensional high- density packaging method that integrates a chip scale package （CSP） in the top package and a fine-pitch ball grid array （FBGA） in the bottom package. In this paper, in-situ scanning electron microscopy （SEM） observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results.展开更多
Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided...Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life （N50%） of a totally electronic board with 36 solder joints.展开更多
基金Projects supported by the National Natural Science Foundation of China(Grant Nos.11072124 and 11272173)the National Basic Research Program of China(Grant No.2010CB631006)the State Key Laboratory of Advanced Metals and Materials, China(Grant No.2010ZD-04)
文摘High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensional high- density packaging method that integrates a chip scale package （CSP） in the top package and a fine-pitch ball grid array （FBGA） in the bottom package. In this paper, in-situ scanning electron microscopy （SEM） observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results.
基金the projects(Nos.11072124 and 11272173)supported by NSFCNational Basic Research Program of China(No.2010CB631006)by State Key Lab of Advanced Metals and Materials(No.2010ZD04)
文摘Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life （N50%） of a totally electronic board with 36 solder joints.
