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Microstructure evolution and mechanical properties of Ti-B-N coatings deposited by plasma-enhanced chemical vapor deposition 被引量:13
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作者 Jung Ho SHIN Kwang Soo CHOI +2 位作者 Tie-gang WANG Kwang Ho KIM Roman NOWAK 《中国有色金属学会会刊:英文版》 CSCD 2012年第S3期722-728,共7页
Ternary Ti-B-N coatings were synthesized on AISI 304 and Si wafer by plasma-enhanced chemical vapor deposition (PECVD) technique using a gaseous mixture of TiCl4,BCl3,H2,N2,and Ar.By virtue of X-ray diffraction analys... Ternary Ti-B-N coatings were synthesized on AISI 304 and Si wafer by plasma-enhanced chemical vapor deposition (PECVD) technique using a gaseous mixture of TiCl4,BCl3,H2,N2,and Ar.By virtue of X-ray diffraction analysis,X-ray photoelectron spectroscopy,scanning electron microscope,and high-resolution transmission electron microscope,the influences of B content on the microstructure and properties of Ti B N coatings were investigated systematically.The results indicated that the microstructure and mechanical properties of Ti-B-N coatings largely depend on the transformation from FCC-TiN phase to HCP-TiB2 phase.With increasing B content and decreasing N content in the coatings,the coating microstructure evolves gradually from FCC-TiN/a-BN to HCP-TiB2 /a-BN via FCC-TiN+HCP-TiB2/a-BN.The highest microhardness of about 34 GPa is achieved,which corresponds to the nanocomposite Ti-63%B-N (mole fraction) coating consisting of the HCP-TiB2 nano-crystallites and amorphous BN phase.The lowest friction-coefficient was observed for the nanocomposite Ti-41%B-N (mole fraction) coating consisting of the FCC-TiN nanocrystallites and amorphous BN 展开更多
关键词 Ti-B-N COATING plasma-enhanced chemical vapor deposition (pecvd) nanocomposite COATING hardness friction coefficient
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Structural evolution and optical characterization in argon diluted Si:H thin films obtained by plasma enhanced chemical vapor deposition
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作者 李志 何剑 +3 位作者 李伟 蔡海洪 龚宇光 蒋亚东 《Journal of Central South University》 SCIE EI CAS 2010年第6期1163-1171,共9页
The structural evolution and optical characterization of hydrogenated silicon(Si:H) thin films obtained by conventional radio frequency(RF) plasma enhanced chemical vapor deposition(PECVD) through decomposition of sil... The structural evolution and optical characterization of hydrogenated silicon(Si:H) thin films obtained by conventional radio frequency(RF) plasma enhanced chemical vapor deposition(PECVD) through decomposition of silane diluted with argon were studied by X-ray diffractometry(XRD),Fourier transform infrared(FTIR) spectroscopy,Raman spectroscopy,transmission electron microscopy(TEM),and ultraviolet and visible(UV-vis) spectroscopy,respectively.The influence of argon dilution on the optical properties of the thin films was also studied.It is found that argon as dilution gas plays a significant role in the growth of nano-crystal grains and amorphous network in Si:H thin films.The structural evolution of the thin films with different argon dilution ratios is observed and it is suggested that argon plasma leads to the nanocrystallization in the thin films during the deposition process.The nanocrystallization initiating at a relatively low dilution ratio is also observed.With the increase of argon portion in the mixed precursor gases,nano-crystal grains in the thin films evolve regularly.The structural evolution is explained by a proposed model based on the energy exchange between the argon plasma constituted with Ar* and Ar+ radicals and the growth regions of the thin films.It is observed that both the absorption of UV-vis light and the optical gap decrease with the increase of dilution ratio. 展开更多
关键词 NANOCRYSTALLIZATION plasma enhanced chemical vapor deposition pecvd hydrogenated silicon (Si:H)
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Hydrophobic Ti_xO_y-C_mH_n Nanoparticle Film Prepared by Plasma Enhanced Chemical Vapor Deposition
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作者 王德信 徐金洲 +5 位作者 刘伟 郭颖 杨沁玉 丁可 石建军 张菁 《Journal of Donghua University(English Edition)》 EI CAS 2012年第3期227-232,共6页
The hydrophobic films of TixOy-CmHn. deposited from mixture gases of titanium isopropoxide (TTIP) and oxygen by plasma enhanced chemical vapor deposition (PECVD) were investigated. The films were investigated by s... The hydrophobic films of TixOy-CmHn. deposited from mixture gases of titanium isopropoxide (TTIP) and oxygen by plasma enhanced chemical vapor deposition (PECVD) were investigated. The films were investigated by scanning electron microscope ( SEM ), transmission electron microscope ( TEM ), Fourier transform infrared spectrometer ( FTIR), X-Ray diffraction ( XRD ), element analysis ( EA ), ultraviolet visible spectrometer ( UV-Vis), and water contact angle (WCA). The results reveal that the surface of the films is formed by mierosized papillaes aggregated by inorganic and organic phases of complex nanoparticles with size from 50 nm to 200 nm when the discharge power is increased from 40 W to 150 W. All fdms demonstrate the strong broad of Ti-O-Ti stretching vibration at 400 -800cm-1, -CH bending vibration at 1 388 cm -1, and broadening -OH stretching vibration at 3 000-3500 cm-1 With the increase of the discharge power, the asdeposited film changes from amorphous to crystallization. The WCA of the film can be as high as 160°, indicating the hydrophobicity. The films show a similar ultraviolet absorption property as the bulk TiO2 film. The composition of the composition of film deposited at 150 W can be formulated as Tio.302-C1.5H3. Therefore, the composition formula of this hydrophobic film could be expressed as TiO2-C5H10O4.7. It is believed that the complex micro/nano structures of TiO2 and C5H10O4.7 residues are responsible for the observed hydrophobicity and the ultraviolet absorption property of the film. 展开更多
关键词 micro/nano structure plasma-enhanced chemical vapor deposition pecvd hydrophobic titanium oxide
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Direct low-temperature synthesis of graphene on various glasses by plasma-enhanced chemical vapor deposition for versatile, cost-effective electrodes 被引量:14
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作者 Jingyu Sun Yubin Chen +11 位作者 Xin Cai Bangjun Ma Zhaolong Chen Manish Kr. Priydarshi Ke Chen Teng Gao Xiuju Song Qingqing Ji Xuefeng Guo Dechun Zou Yanfeng Zhang Zhongfan Liu 《Nano Research》 SCIE EI CAS CSCD 2015年第11期3496-3504,共9页
Catalyst-free and scalable synthesis of graphene on various glass substrates at low temperatures is of paramount significance to numerous applications such as low-cost transparent electronics and state-of-the-art disp... Catalyst-free and scalable synthesis of graphene on various glass substrates at low temperatures is of paramount significance to numerous applications such as low-cost transparent electronics and state-of-the-art displays. However, systematic study within this promising research field has remained scarce thus far. Herein, we report the direct growth of graphene on various glasses using a low-temperature plasma-enhanced chemical vapor deposition method. Such a facile and scalable approach guarantees the growth of uniform, transfer-free graphene films on various glass substrates at a growth temperature range of 400-600 ℃. The morphological, surface wetting, optical, and electrical properties of the obtained graphene can be tailored by controlling the growth parameters. Our uniform and high-quality graphene films directly integrated with low-cost, commonly used glasses show great potential in the fabrication of multi-functional electrodes for versatile applications in solar cells, transparent electronics, and smart windows. 展开更多
关键词 GRAPHENE DIRECT plasma-enhanced chemical vapor deposition pecvd glass VARIOUS low-cost
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Effects of various substrate materials on structural and optical properties of amorphous silicon nitride thin films deposited by plasma-enhanced chemical vapor deposition 被引量:2
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作者 Liangyi Hang Weiguo Liu Junqi Xu 《Chinese Optics Letters》 SCIE EI CAS CSCD 2020年第8期81-86,共6页
The plasma-enhanced chemical vapor deposition(PECVD)technique is well suited for fabricating optical filters with continuously variable refractive index profiles;however,it is not clear how the optical and structural ... The plasma-enhanced chemical vapor deposition(PECVD)technique is well suited for fabricating optical filters with continuously variable refractive index profiles;however,it is not clear how the optical and structural properties of thin films differ when deposited on different substrates.Herein,silicon nitride films were deposited on silicon,fused silica,and glass substrates by PECVD,using silane and ammonia,to investigate the effects of the substrate used on the optical properties and structures of the films.All of the deposited films were amorphous.Further,the types and amounts of Si-centered tetrahedral Si–SivN4-v bonds formed were based upon the substrates used;Si–N4 bonds with higher elemental nitrogen content were formed on Si substrates,which lead to obtaining higher refractive indices,and the Si–SiN3 bonds were mainly formed on glass and fused silica substrates.The refractive indices of the films formed on the different substrates had a maximum difference of0.05(at 550 nm),the refractive index of SiNx films formed on silicon substrates was 1.83,and the refractive indices of films formed on glass were very close to those formed on fused silica.The deposition rates of these SiNx films are similar,and the extinction coefficients of all the films were lower than 10-4. 展开更多
关键词 thin films plasma-enhanced chemical vapor deposition optical properties structural properties substrate materials
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High rate deposition of microcrystalline silicon films by high-pressure radio frequency plasma enhanced chemical vapor deposition (PECVD) 被引量:1
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作者 ZHOU BingQing ZHU MeiFang +4 位作者 LIU FengZhen LIU JinLong ZHOU YuQin LI GuoHua DING Kun 《Science China(Technological Sciences)》 SCIE EI CAS 2008年第4期371-377,共7页
Hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared by high- pressure radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD) with a screened plasma. The deposition rate ... Hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared by high- pressure radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD) with a screened plasma. The deposition rate and crystallinity varying with the deposition pressure, rf power, hydrogen dilution ratio and electrodes distance were systematically studied. By optimizing the deposition parameters the device quality μc-Si:H films have been achieved with a high deposition rate of 7.8 /s at a high pressure. The Voc of 560 mV and the FF of 0.70 have been achieved for a single-junction μc-Si:H p-i-n solar cell at a deposition rate of 7.8 /s. 展开更多
关键词 RADIO-FREQUENCY plasma enhanced chemical vapor deposition (rf-pecvd) MICROCRYSTALLINE silicon FILM high rate deposition
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SUBSTRATE EFFECT ON HYDROGENATED MICROCRYSTALLINE SILICON FILMS DEPOSITED WITH VHF-PECVD TECHNIQUE
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作者 H.D. Yang 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2006年第4期295-300,共6页
Raman spectra and scanning electron microscope (SEM) techniques were used to determine the structural properties of microcrb'stalline silicon (μc-Si:H) films deposited on different substrates with the very high... Raman spectra and scanning electron microscope (SEM) techniques were used to determine the structural properties of microcrb'stalline silicon (μc-Si:H) films deposited on different substrates with the very high frequency plasma-enhanced chemical vapor deposition (VHF-PECVD) technique. Using the Raman spectra, the values of crystalline volume fraction Xc and average grain size d are 86%, 12.3nm; 65%, 5.45nm; and 38%, 4.05nm, for single crystalline silicon wafer, coming 7059 glass, and general optical glass substrates, respectively. The SEM images further demonstrate the substrate effect on the film surface roughness. For the single crystalline silicon wafer and Coming 7059 glass, the surfaces of the μc-Si:H films are fairly smooth because of the homogenous growth or h'ttle lattice mismatch. But for general optical glass, the surface of the μ-Si: H film is very rough, thus the growing surface roughness affects the crystallization process and determines the average grain size of the deposited material. Moreover, with the measurements of thickness, photo and dark conductivity, photosensitivity and activation energy, the substrate effect on the deposition rate, optical and electrical properties of the μc-Si:H thin films have also been investigated. On the basis of the above results, it can be concluded that the substrates affect the initial growing layers acting as a seed for the formation of a crystalline-like material and then the deposition rates, optical and electrical properties are also strongly influenced, hence, deposition parameter optimization is the key method that can be used to obtain a good initial growing layer, to realize the deposition of μc-Si:H films with device-grade quality on cheap substrates such as general glass. 展开更多
关键词 hydrogenated microcrystalline silicon film VHF-pecvd (very high frequency plasma-enhanced chemical vapor deposition substrate effect
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Preparation of TiO2/MCM-41 by plasma enhanced chemical vapor deposition method and its photocatalytic activity 被引量:3
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作者 Shenghung WANG Kuohua WANG +1 位作者 Jihmirn JEHNG Lichen LIU 《Frontiers of Environmental Science & Engineering》 SCIE EI CAS CSCD 2012年第3期304-312,共9页
Titanium dioxide is coated on the surface of MCM-41 wafer through the plasma enhanced chemical vapor deposition (PECVD) method using titanium isopropoxide (TTIP) as a precursor. Annealing temperature is a key fact... Titanium dioxide is coated on the surface of MCM-41 wafer through the plasma enhanced chemical vapor deposition (PECVD) method using titanium isopropoxide (TTIP) as a precursor. Annealing temperature is a key factor affecting crystal phase of titanium dioxide. It will transform an amorphous structure to a polycrystalline structure by increasing temperature. The optimum anatase phase of TiO2 which can acquire the best methanol conversion under UV-light irradiation is obtained under an annealing temperature of 700℃ for 2 h, substrate tem- perature of 500~C, 70 mL. min1 of oxygen flow rate, and 100W of plasma power. In addition, the films are composed of an anatase-rutile mixed phase, and the ratio of anatase to rutile varies with substrate temperature and oxygen flow rate. The particle sizes of titanium dioxide are between 30.3 nm and 59.9nm by the calculation of Scherrer equation. Under the reaction conditions of ll6.8mg.L-1 methanol, 2.9mg.L-1 moisture, and 75~C of reaction temperature, the best conversion of methanol with UV-light is 48.2% by using the anatase-rutile (91.3/ 8.7) mixed phase TiO2 in a batch reactor for 60 min. While under fluorescent light irradiation, the best photoactivity appears by using the anatase-rutile (55.4/44.6) mixed phase TiO2 with a conversion of 40.0%. 展开更多
关键词 PHOTOCATALYST titanium dioxide MCM-41 plasma enhanced chemical vapor deposition pecvd
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PECVD法氮化硅薄膜生长工艺的研究 被引量:20
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作者 陶涛 苏辉 +7 位作者 谢自力 张荣 刘斌 修向前 李毅 韩平 施毅 郑有炓 《微纳电子技术》 CAS 北大核心 2010年第5期267-272,303,共7页
采用等离子体增强化学气相沉积法(PECVD),在单晶硅衬底(100)上成功制备了不同生长工艺条件下的氮化硅薄膜。分别采用XP-2台阶仪、椭圆偏振仪等手段测试了薄膜的厚度、折射率、生长速率等参数。并采用原子力显微镜(AFM)研究了薄膜的表面... 采用等离子体增强化学气相沉积法(PECVD),在单晶硅衬底(100)上成功制备了不同生长工艺条件下的氮化硅薄膜。分别采用XP-2台阶仪、椭圆偏振仪等手段测试了薄膜的厚度、折射率、生长速率等参数。并采用原子力显微镜(AFM)研究了薄膜的表面形貌。结果表明,温度和射频功率是影响薄膜生长速率的主要因素,生长速率变化幅度可以达到230nm/min甚至更高。对于薄膜折射率和成分影响最大的是NH3流量,折射率变化范围可以达到2.7~1.86。分析得出受工艺参数调控的薄膜生长速率对薄膜的性质有重要影响。 展开更多
关键词 等离子体增强化学气相沉积法 氮化硅薄膜 生长速率 折射率 硅衬底
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PECVD法低温制备二氧化硅薄膜(英文) 被引量:6
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作者 李东玲 尚正国 +1 位作者 温志渝 王胜强 《纳米技术与精密工程》 CAS CSCD 2013年第2期185-190,共6页
针对金属层间介质以及MEMS等对氧化硅薄膜的需求,介绍了采用等离子增强型化学气相沉积(PECVD)技术,以SiH4和N2O为反应气体,低温制备SiO2薄膜的方法.利用椭偏仪和应力测试系统对制得的SiO2薄膜的厚度、折射率、均匀性以及应力等性能指标... 针对金属层间介质以及MEMS等对氧化硅薄膜的需求,介绍了采用等离子增强型化学气相沉积(PECVD)技术,以SiH4和N2O为反应气体,低温制备SiO2薄膜的方法.利用椭偏仪和应力测试系统对制得的SiO2薄膜的厚度、折射率、均匀性以及应力等性能指标进行了测试,探讨了射频功率、反应腔室压力、气体流量比等关键工艺参数对SiO2薄膜性能的影响.结果表明:SiO2薄膜的折射率主要由N2O/SiH4的流量比决定,而薄膜均匀性主要受电极间距以及反应腔室压力的影响.通过优化工艺参数,在低温260℃下制备了折射率为1.45~1.52、均匀性为±0.64%、应力在-350~-16MPa可控的SiO2薄膜.采用该方法制备的SiO2薄膜均匀性好、结构致密、沉积速率快、沉积温度低且应力可控,可广泛应用于集成电路以及MEMS器件中. 展开更多
关键词 二氧化硅 等离子增强型化学气相沉积(pecvd) 折射率 均匀性 应力
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气压对VHF-PECVD制备的μc-Si∶H薄膜特性影响的研究 被引量:14
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作者 张晓丹 朱锋 +8 位作者 赵颖 侯国付 魏长春 孙建 张德坤 任慧志 薛俊明 耿新华 熊绍珍 《人工晶体学报》 EI CAS CSCD 北大核心 2004年第3期414-418,共5页
本文主要研究了用VHF PECVD方法制备的不同工作气压的微晶硅薄膜样品。结果表明 :沉积速率随反应气压的增大而逐渐增大 ;光敏性 (光电导 /暗电导 )和激活能测试结果给出了相同的变化规律 ;傅立叶红外测试、X射线衍射和室温微区喇曼谱的... 本文主要研究了用VHF PECVD方法制备的不同工作气压的微晶硅薄膜样品。结果表明 :沉积速率随反应气压的增大而逐渐增大 ;光敏性 (光电导 /暗电导 )和激活能测试结果给出了相同的变化规律 ;傅立叶红外测试、X射线衍射和室温微区喇曼谱的结果都表明了样品的晶化特性 ; 展开更多
关键词 VHF-pecvd 制备方法 气压 μc-Si:H 薄膜 微晶硅材料 太阳能电池 光致衰退效应 SWE
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射频PECVD方法生长含氢非晶碳膜的结构及摩擦学性能 被引量:4
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作者 李明 蔺增 +1 位作者 王凤 巴德纯 《东北大学学报(自然科学版)》 EI CAS CSCD 北大核心 2007年第12期1745-1748,共4页
利用射频等离子体增强化学气相沉积技术在不锈钢表面制备了含氢非晶碳膜.采用Raman光谱、红外光谱、X射线光电子能谱和原子力显微镜等研究了薄膜的微观结构和表面形貌,在栓盘摩擦磨损试验机上考察了薄膜在不同载荷与滑动速度下的摩擦学... 利用射频等离子体增强化学气相沉积技术在不锈钢表面制备了含氢非晶碳膜.采用Raman光谱、红外光谱、X射线光电子能谱和原子力显微镜等研究了薄膜的微观结构和表面形貌,在栓盘摩擦磨损试验机上考察了薄膜在不同载荷与滑动速度下的摩擦学性能.结果表明:所制备的含氢非晶碳膜具有典型的类金刚石结构特征,薄膜均匀、致密,表面粗糙度小;薄膜与不锈钢球对磨时显示出良好的抗磨减摩性能;薄膜的抗磨减摩性能同对磨件表面上形成的转移膜以及摩擦过程中薄膜结构的石墨化相关. 展开更多
关键词 射频等离子体增强化学气相沉积 含氢非晶碳膜 结构 摩擦学性能
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射频PECVD高速沉积微晶硅薄膜 被引量:3
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作者 杨根 谷锦华 +5 位作者 卢景霄 陈永生 张丽伟 吴芳 汪昌州 李红菊 《真空科学与技术学报》 EI CAS CSCD 北大核心 2007年第3期250-253,共4页
本文采用射频等离子体增强化学气相沉积(RF-PECVD)技术高速沉积微晶硅薄膜。系统研究了射频功率、气体总流量、沉积气压、硅烷浓度等沉积参数对薄膜沉积速率和晶化率的影响。通过沉积参数的优化,使微晶硅薄膜沉积速率达到了3/s左右。
关键词 等离子体增强化学气相沉积 微晶硅薄膜 高压耗尽法 高速沉积
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H_2稀释在PECVD法制备微晶硅薄膜中的影响 被引量:3
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作者 王生钊 卢景霄 +5 位作者 王红娟 刘萍 陈永生 张丽伟 杨仕娥 郜小勇 《可再生能源》 CAS 2006年第4期18-20,共3页
利用等离子增强化学气相沉积(PECVD)技术,研究了H稀释度D=H 2/(H 2+SiH 4)对在玻璃和不锈钢衬底上低温制备微晶硅薄膜的晶化率、晶粒尺寸、薄膜质量等的影响。结果表明,随着硅烷浓度的降低,样品的晶化率、晶粒尺寸有所改变。当D=99%时,... 利用等离子增强化学气相沉积(PECVD)技术,研究了H稀释度D=H 2/(H 2+SiH 4)对在玻璃和不锈钢衬底上低温制备微晶硅薄膜的晶化率、晶粒尺寸、薄膜质量等的影响。结果表明,随着硅烷浓度的降低,样品的晶化率、晶粒尺寸有所改变。当D=99%时,晶粒突然变大,晶化率显著提高。因此,我们认为此时的硅薄膜由非晶硅转化为微晶硅。 展开更多
关键词 pecvd 氢稀释 微晶硅薄膜
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VHF-PECVD制备微晶硅材料及电池初步研究 被引量:4
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作者 张晓丹 朱锋 +4 位作者 赵颖 薛俊明 孙建 耿新华 熊绍珍 《太阳能学报》 EI CAS CSCD 北大核心 2004年第6期789-793,共5页
研究了用甚高频等离子体增强化学气相沉积(VHF-PECVD)方法制备的不同沉积气压下的微晶硅薄膜样品。随着沉积气压的逐渐增大,样品的沉积速率也逐渐增大;样品的光敏性和激活能测试结果表明:随气压的变化两者发生了规律性一致的变化;傅立... 研究了用甚高频等离子体增强化学气相沉积(VHF-PECVD)方法制备的不同沉积气压下的微晶硅薄膜样品。随着沉积气压的逐渐增大,样品的沉积速率也逐渐增大;样品的光敏性和激活能测试结果表明:随气压的变化两者发生了规律性一致的变化;傅立叶变换红外(FTIR)测试表明制备的样品中含有一定量的氧,使得样品呈现弱n型;室温微区喇曼光谱测试分析得到样品的微晶化特征与IR的分析是一致的,用高斯函数对喇曼谱解谱分析定量得出了晶化程度;分析了H处理p/I界面对电池性能的影响;首次在国内用VHF-PECVD制备出效率达4.24%的微晶硅电池。 展开更多
关键词 甚高频等离子体增强化学气相沉积 微晶硅薄膜 微晶硅电池 微区喇曼光谱 傅立叶变换红外光谱
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淀积参数对PECVD氮化硅薄膜力学特性的影响 被引量:2
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作者 王小飞 韩建强 +1 位作者 宋美绚 严天宏 《微纳电子技术》 CAS 北大核心 2011年第4期233-236,共4页
等离子增强化学气相淀积(PECVD)法制备的氮化硅薄膜具有沉积温度低、生长速率高和残余应力可调节等特点,研究其力学特性对研制MEMS器件和系统具有重要意义。采用HQ-2型PECVD淀积台,在沉积温度为350℃,NH3流量为30cm3/min的条件下,通过... 等离子增强化学气相淀积(PECVD)法制备的氮化硅薄膜具有沉积温度低、生长速率高和残余应力可调节等特点,研究其力学特性对研制MEMS器件和系统具有重要意义。采用HQ-2型PECVD淀积台,在沉积温度为350℃,NH3流量为30cm3/min的条件下,通过改变氩气稀释至5%的SiH4流量和射频功率大小,制备了具有压应力、微应力和张应力的多种氮化硅薄膜样品。采用纳米压痕仪Nanoidenter-G200对淀积薄膜的杨氏模量和硬度进行测试,结果表明,在较小的SiH4流量和较高的射频功率条件下,淀积的氮化硅薄膜具有更高的杨氏模量和硬度。 展开更多
关键词 氮化硅(SiNx)薄膜 等离子化学气相淀积(pecvd) 纳米压痕 杨氏模量 硬度
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PECVD制备六方金刚石结构碳氢薄膜 被引量:1
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作者 曹忠跃 张斌 +1 位作者 魏利 张俊彦 《中国表面工程》 EI CAS CSCD 北大核心 2013年第4期55-59,共5页
利用等离子体增强化学气相沉积技术(PECVD)在单晶硅(100)表面上制备了一层含有六方金刚石结构的碳氢薄膜。采用透射电子显微镜和拉曼光谱仪对薄膜结构进行表征;并用Nano-indenterⅡ型纳米压痕仪和CSM—摩擦磨损试验机对薄膜的力学性能... 利用等离子体增强化学气相沉积技术(PECVD)在单晶硅(100)表面上制备了一层含有六方金刚石结构的碳氢薄膜。采用透射电子显微镜和拉曼光谱仪对薄膜结构进行表征;并用Nano-indenterⅡ型纳米压痕仪和CSM—摩擦磨损试验机对薄膜的力学性能和摩擦学性能进行了测试。结果表明:该碳氢薄膜含有六方金刚石结构,另外还含有少量的纳米弯曲石墨片段;与制备的类金刚石碳氢薄膜相比,该薄膜具有较好的力学性能,同时该薄膜在空气环境下表现出了较好的摩擦学性能。 展开更多
关键词 等离子增强化学气相沉积 碳氢薄膜 六方金刚石 摩擦性能
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PECVD镀膜机等离子体静电探针诊断 被引量:1
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作者 王庆 巴德纯 +1 位作者 徐香坤 徐化冰 《真空科学与技术学报》 EI CAS CSCD 北大核心 2009年第3期332-335,共4页
开发了一个朗缪尔探针等离子体诊断系统,对PECVD真空镀膜机进行了等离子体参数诊断。该镀膜机内的等离子体是电容偶合激发方式的氩等离子体,激发源为射频电源(13.56MHz)。在射频功率为40W到140W的范围内,使用该朗缪尔探针对镀膜机中氩... 开发了一个朗缪尔探针等离子体诊断系统,对PECVD真空镀膜机进行了等离子体参数诊断。该镀膜机内的等离子体是电容偶合激发方式的氩等离子体,激发源为射频电源(13.56MHz)。在射频功率为40W到140W的范围内,使用该朗缪尔探针对镀膜机中氩等离子体的参数(等离子体密度和电子温度)进行了诊断分析。结果表明:电子温度在2.7eV和6.4eV之间,并且随着射频功率的增加而降低。而等离子体的密度在0.85×1015m-3到8×1016m-3的范围随着射频电源的增加而增加。 展开更多
关键词 等离子体增强化学气相沉积 镀膜机 等离子体诊断 朗缪尔探针
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亚微米间距PECVD填隙工艺研究 被引量:1
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作者 王学毅 王飞 +2 位作者 冉明 刘嵘侃 杨永晖 《微纳电子技术》 北大核心 2016年第1期60-63,共4页
将半导体制造中常规的等离子增强化学气相淀积(PECVD)SiO_2工艺和等离子反应离子刻蚀(RIE)SiO_2工艺结合起来,利用三步填充法实现亚微米间距的金属间介质填充制作。此方法有效解决了常规微米级等离子增强化学气相淀积工艺填充亚微米金... 将半导体制造中常规的等离子增强化学气相淀积(PECVD)SiO_2工艺和等离子反应离子刻蚀(RIE)SiO_2工艺结合起来,利用三步填充法实现亚微米间距的金属间介质填充制作。此方法有效解决了常规微米级等离子增强化学气相淀积工艺填充亚微米金属条间隙的空洞问题。实验结果表明,在尺寸大于0.5μm的金属条间隙中没有发现介质填充的空洞问题。空洞问题的解决,使得"三步填充法"的介质填充技术在工艺中能够实用化,并应用到亚微米多层金属布线工艺当中。 展开更多
关键词 等离子增强化学气相淀积(pecvd) 二氧化硅(SiO2) 反应离子刻蚀(RIE) 三步填充法 亚微米间隙 金属间介质(IMD) 空洞
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基于PECVD的TSV深孔绝缘层沉积工艺优化 被引量:2
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作者 唐伟 王文杰 +3 位作者 吴道伟 李宝霞 杜亚飞 赵鸿 《微纳电子技术》 北大核心 2020年第6期492-497,共6页
研究了基于等离子体增强化学气相沉积(PECVD)法的硅通孔(TSV)中(孔径5μm,深宽比10∶1)二氧化硅(SiO2)薄膜的生长技术。分析了低频功率、腔室压力和分步沉积次数对TSV深孔SiO2膜层覆盖率的影响。实验结果表明,深孔内底部的膜层覆盖率最... 研究了基于等离子体增强化学气相沉积(PECVD)法的硅通孔(TSV)中(孔径5μm,深宽比10∶1)二氧化硅(SiO2)薄膜的生长技术。分析了低频功率、腔室压力和分步沉积次数对TSV深孔SiO2膜层覆盖率的影响。实验结果表明,深孔内底部的膜层覆盖率最高,孔内拐角处的膜层覆盖率最低。在低频功率为300 W、腔室压力为1.6 Torr (1 Torr=133.3 Pa)、分步沉积8次时,孔内最薄处的拐角覆盖率由2.23%提高到了4.88%,有效提高了膜层的覆盖率。最后,对膜层的击穿电压、漏电流、表面应力和沉积速率进行了检测,结果表明在保证膜层电性能基础上,将深孔SiO2薄膜的沉积速率提高到了480.075 nm/min。 展开更多
关键词 等离子体增强化学气相沉积(pecvd) 硅通孔(TSV) 二氧化硅(SiO2) 覆盖率 沉积速率
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