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EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS 被引量:7
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作者 XUE Songbai WU Yuxiu HAN Zongjie WANG Jianxin 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2007年第4期40-43,共4页
The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when t... The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly. 展开更多
关键词 Quad flat package (QFP) maximum equivalent stress Soldered joints Assembly optimization Finite element method
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Numerical Simulation on Interfacial Creep Failure of Dissimilar Metal Welded Joint between HR3C and T91 Heat-Resistant Steel 被引量:1
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作者 张建强 TANG Yi +3 位作者 ZHANG Guodong ZHAO Xuan GUO Jialin LUO Chuanhong 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2016年第5期1068-1074,共7页
The maximum principal stress, von Mises equivalent stress, equivalent creep strain, stress triaxiality in dissimilar metal welded joints between austenitic(HR3C) and martensitic heat-resistant steel(T91) are simul... The maximum principal stress, von Mises equivalent stress, equivalent creep strain, stress triaxiality in dissimilar metal welded joints between austenitic(HR3C) and martensitic heat-resistant steel(T91) are simulated by FEM at 873 K and under inner pressure of 42.26 MPa. The results show that the maximum principal stress and von Mises equivalent stress are quite high in the vicinity of weld/T91 interface, creep cavities are easy to form and expand in the weld/T91 interface. There are two peaks of equivalent creep strains in welded joint, and the maximum equivalent creep strain is in the place 27-32 mm away from the weld/T91 interface, and there exists creep constrain region in the vicinity of weld/T91 interface. The high stress triaxiality peak is located exactly at the weld/T91 interface. Accordingly, the weld/T91 interface is the weakest site of welded joint. Therefore, using stress triaxiality to describe creep cavity nucleation and expansion and crack development is reasonable for the dissimilar metal welded joint between austenitic and martensitic steel. 展开更多
关键词 dissimilar metal welded joint maximum principal stress equivalent stress creep strain stress triaxiality
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