A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micr...A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.展开更多
The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show tha...The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show that in the drawn poly-crystal copper wires produced by traditional continuous casting,111 and 100 duplex fiber texture forms,and with increasing strain,the intensities of 111 and 100 increase.In the drawn single-crystal copper wires produced by Ohno continuous casting,100 rotates to 111,and there is inhomogeneous distribution of fiber texture along radial direction of the wires,which is caused by the distribution of shear deformation.Compared with 100,111 fiber texture is more stable in the drawn copper wires.Comparison of the experimental results with the simulated results shows that the simulation by Taylor model can analyze the texture evolution of drawn copper wires.展开更多
The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by poten...The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) and compared with the results obtained in 0.5 mol/L H2SO4. In the oxygen diffusion-limited range, size effect is found to occur independent of electrolytes, which is attributed to non-linear diffusion. Additionally, to satisfy application in a marine setting, an empirical equation correlating oxygen diffusion-limited current density to copper wire radius is proposed by fitting experimental data.展开更多
When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an...When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an adiabatic condition. However, it has been recognized in the experiment that the thicker copper wires of φ1 mm are not completely melted, but sheared mainly at the connecting terminal by a relatively low impulse current. Electro-magnetic mechanical shearing stress, etc. are discussed in addition to the conventional Joule heating. New broken mechanisms were presumed and proved in the additional experiments.展开更多
The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been s...The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtain the time-dependent radius (R-t) curve. The experimental results demonstrate that the mean expansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according to the peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to giving a profound understanding of the early stage of wire-array Z-pinch physics and to improvement on their design.展开更多
In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid s...In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid support, which was at first coated by 3-mercaptopropyltrimethoxysi- lane. A stationary phase of oxidized multi walled carbon nanotube (MWCNTs)) was bonded to the surface of the copper wire. The developed SPME was characterized by IR and Scanning Electron Microscopy (SEM) and coupled to gas chromatography for separation of the analytes. Stability of the fiber, the effect of coating thickness and recovery time were optimized. The MWCNTs film thickness was about 5 μm which was perfect for a rapid mass transfer. The detection limits were at the range of 0.005 to 0.1 μg·L<sup>-1</sup>. The calibration curves were linear R<sup>2</sup> > 0.9813 in the range of 0.01 to 5 μg·L<sup>-1</sup>. The method has been successfully applied for real samples with standard addition of 5 μL<sup>-1</sup> of each sample. Stability study of the fiber to acid and alkali shows that it can be used for more than 50 times.展开更多
By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the num...By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y =1.86×10 -8 e -0.90/ x . Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.展开更多
The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and micr...The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and microhardness test.The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing.The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible,and the wedge bonding is achieved by wear action induced by ultrasonic vibration.The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.展开更多
By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstr...By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstructures in the wires mainly include extended planar dislocation boundaries, a small fraction of twins and some dislocation cells sharing boundaries parallel to drawn direction. Besides the typical microstructures, 9R structure configurations were observed in the wires. The formation of 9R polytypes may be caused by the coupled emission of Shockley dislocations from a boundary.展开更多
Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin...Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.展开更多
The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the...The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.展开更多
Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable met...Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.展开更多
Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controll...Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controller of the dimension of AgNPs. Influence of growth parameters such as precursor's concentration, ratio proportion of PVP and ultra-sonication on the growth of AgNPs coating are determined. The best morphology, size of the AgNPs are observed on copper wire. The results show that the copper wire coated with AgNPs of^100 nm diameter exhibits good antioxidation and ohmic contact after sinter on Si substrate at a temperature as low as 320℃, is especially suitable as a substitute for silver paste electrode used in silicon solar cells.展开更多
Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diamete...Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.展开更多
Aluminum–Lithium(Al–Li) alloy is a topic of great interest owing to its high strength and light weight, but there are only a few applications of Al–Li alloy in wire ss, a special AA2050 Al–Li alloy + arc additive ...Aluminum–Lithium(Al–Li) alloy is a topic of great interest owing to its high strength and light weight, but there are only a few applications of Al–Li alloy in wire ss, a special AA2050 Al–Li alloy + arc additive manufacturing(WAAM) process. To identify its feasibility in WAAM procewire was produced and employed in the production of straight-walled components, using a WAAM system based on variable polarity gas tungsten arc welding(VP-GTAW) process. The influence of post-deposited heat treatment on the microstructure and property of the deposit was investigated using optical micrographs(OM), scanning electron microscopy(SEM), X-ray diffraction(XRD), hardness and tensile properties tests. Results revealed that the microstructures of AA2050 aluminum deposits varied with their location layers. The upper layers consisted of fine equiaxed grains, while the bottom layer exhibited a coarse columnar structure. Mechanical properties witnessed a significant improvement after post-deposited heat treatment, with the average micro-hardness reaching 141 HV and the ultimate tensile strength exceeding 400 MPa. Fracture morphology exhibited a typical ductile fracture.展开更多
On-demand droplet sorting is extensively applied for the efficient manipulation and genome-wide analysis of individual cells.However,state-of-the-art microfluidic chips for droplet sorting still suffer from low sortin...On-demand droplet sorting is extensively applied for the efficient manipulation and genome-wide analysis of individual cells.However,state-of-the-art microfluidic chips for droplet sorting still suffer from low sorting speeds,sample loss,and labor-intensive preparation procedures.Here,we demonstrate the development of a novel microfluidic chip that integrates droplet generation,on-demand electrostatic droplet charging,and high-throughput sorting.The charging electrode is a copper wire buried above the nozzle of the microchannel,and the deflecting electrode is the phosphate buffered saline in the microchannel,which greatly simplifies the structure and fabrication process of the chip.Moreover,this chip is capable of high-frequency droplet generation and sorting,with a frequency of 11.757 kHz in the drop state.The chip completes the selective charging process via electrostatic induction during droplet generation.On-demand charged microdroplets can arbitrarilymove to specific exit channels in a three-dimensional(3D)-deflected electric field,which can be controlled according to user requirements,and the flux of droplet deflection is thereby significantly enhanced.Furthermore,a lossless modification strategy is presented to improve the accuracy of droplet deflection or harvest rate from 97.49% to 99.38% by monitoring the frequency of droplet generation in real time and feeding it back to the charging signal.This chip has great potential for quantitative processing and analysis of single cells for elucidating cell-to-cell variations.展开更多
基金the National Natural Science Foundation of China(Nos.U21A2051,52173297,52071133)the R&D Projects of Henan Academy of Sciences of China(No.220910009)+2 种基金the Key R&D and Promotion Projects of Henan Province of China(No.212102210441)the Joint Fund of Henan Science and Technology R&D Plan of China(No.222103810037)the Zhongyuan Scholar Workstation Funded Project of China(No.214400510028).
文摘A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.
基金Projects(50771076,50901055)supported by the National Natural Science Foundation of ChinaProject(07JK274)supported by the Education Department Foundation of Shaanxi Province,China
文摘The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show that in the drawn poly-crystal copper wires produced by traditional continuous casting,111 and 100 duplex fiber texture forms,and with increasing strain,the intensities of 111 and 100 increase.In the drawn single-crystal copper wires produced by Ohno continuous casting,100 rotates to 111,and there is inhomogeneous distribution of fiber texture along radial direction of the wires,which is caused by the distribution of shear deformation.Compared with 100,111 fiber texture is more stable in the drawn copper wires.Comparison of the experimental results with the simulated results shows that the simulation by Taylor model can analyze the texture evolution of drawn copper wires.
基金Supported by the National Natural Science Foundation of China (No.50971118)
文摘The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) and compared with the results obtained in 0.5 mol/L H2SO4. In the oxygen diffusion-limited range, size effect is found to occur independent of electrolytes, which is attributed to non-linear diffusion. Additionally, to satisfy application in a marine setting, an empirical equation correlating oxygen diffusion-limited current density to copper wire radius is proposed by fitting experimental data.
文摘When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an adiabatic condition. However, it has been recognized in the experiment that the thicker copper wires of φ1 mm are not completely melted, but sheared mainly at the connecting terminal by a relatively low impulse current. Electro-magnetic mechanical shearing stress, etc. are discussed in addition to the conventional Joule heating. New broken mechanisms were presumed and proved in the additional experiments.
基金The project supported by Pre-research Foundation of Chinese Acadeny of Engineering Physics(No.20010103)
文摘The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtain the time-dependent radius (R-t) curve. The experimental results demonstrate that the mean expansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according to the peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to giving a profound understanding of the early stage of wire-array Z-pinch physics and to improvement on their design.
文摘In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid support, which was at first coated by 3-mercaptopropyltrimethoxysi- lane. A stationary phase of oxidized multi walled carbon nanotube (MWCNTs)) was bonded to the surface of the copper wire. The developed SPME was characterized by IR and Scanning Electron Microscopy (SEM) and coupled to gas chromatography for separation of the analytes. Stability of the fiber, the effect of coating thickness and recovery time were optimized. The MWCNTs film thickness was about 5 μm which was perfect for a rapid mass transfer. The detection limits were at the range of 0.005 to 0.1 μg·L<sup>-1</sup>. The calibration curves were linear R<sup>2</sup> > 0.9813 in the range of 0.01 to 5 μg·L<sup>-1</sup>. The method has been successfully applied for real samples with standard addition of 5 μL<sup>-1</sup> of each sample. Stability study of the fiber to acid and alkali shows that it can be used for more than 50 times.
文摘By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y =1.86×10 -8 e -0.90/ x . Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.
基金Prpject(E052104/50705021)supported by the National Natural Science Foundation of ChinaProject(2006:01504489)supported by the Development Program for Outstanding Young Teachers in HIT
文摘The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and microhardness test.The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing.The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible,and the wedge bonding is achieved by wear action induced by ultrasonic vibration.The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.
基金Project(50771076) supported by the National Natural Science Foundation of ChinaProject(07JK274) supported by the Education Department of Shaanxi Province, China
文摘By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstructures in the wires mainly include extended planar dislocation boundaries, a small fraction of twins and some dislocation cells sharing boundaries parallel to drawn direction. Besides the typical microstructures, 9R structure configurations were observed in the wires. The formation of 9R polytypes may be caused by the coupled emission of Shockley dislocations from a boundary.
文摘Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.
基金Supported by the National Natural Science Foundation of China (Grant Nos. 50471098 and 59971033)the Natural Science Foundation of Shaanxi Province, China (Grant No. 2003E101)the Teaching and Research Award Program for Outstanding Young Teachers in Higher Education Institution of MOE, China
文摘The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.
文摘Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.
基金financially supported by the National Natuie Science Foundation of China (No 11204082)Shanghai Natural Pond (No, 16ZR1410700)
文摘Silver nanoparticles (AgNPs) are directly grown on surface of ~25 μm copper wire by ultrasound-assisted chemical reduction. Silver nitrate is used as precursors, when polyvinylpyrrolidone (PVP) is added as a controller of the dimension of AgNPs. Influence of growth parameters such as precursor's concentration, ratio proportion of PVP and ultra-sonication on the growth of AgNPs coating are determined. The best morphology, size of the AgNPs are observed on copper wire. The results show that the copper wire coated with AgNPs of^100 nm diameter exhibits good antioxidation and ohmic contact after sinter on Si substrate at a temperature as low as 320℃, is especially suitable as a substitute for silver paste electrode used in silicon solar cells.
文摘Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.
基金Supported by National Natural Science Foundation of China(Grant No.51675031)Beijing Municipal Science and Technology Commission and Fundamental Research Funds for the Central Universities(Grant No.YWF-18-BJ-J-244,YWF-19-BJ-J-232)+1 种基金Beijing Natural Science Foundation(Grant No.3182020)the Academic Excellence Foundation of BUAA for PhD
文摘Aluminum–Lithium(Al–Li) alloy is a topic of great interest owing to its high strength and light weight, but there are only a few applications of Al–Li alloy in wire ss, a special AA2050 Al–Li alloy + arc additive manufacturing(WAAM) process. To identify its feasibility in WAAM procewire was produced and employed in the production of straight-walled components, using a WAAM system based on variable polarity gas tungsten arc welding(VP-GTAW) process. The influence of post-deposited heat treatment on the microstructure and property of the deposit was investigated using optical micrographs(OM), scanning electron microscopy(SEM), X-ray diffraction(XRD), hardness and tensile properties tests. Results revealed that the microstructures of AA2050 aluminum deposits varied with their location layers. The upper layers consisted of fine equiaxed grains, while the bottom layer exhibited a coarse columnar structure. Mechanical properties witnessed a significant improvement after post-deposited heat treatment, with the average micro-hardness reaching 141 HV and the ultimate tensile strength exceeding 400 MPa. Fracture morphology exhibited a typical ductile fracture.
基金The authors acknowledge the financial support from the NationalNatural Science Foundation ofChina(No.52275562)the Technology Innovation Fund of Huazhong University of Science and Technology(No.2022JYCXJJ015).
文摘On-demand droplet sorting is extensively applied for the efficient manipulation and genome-wide analysis of individual cells.However,state-of-the-art microfluidic chips for droplet sorting still suffer from low sorting speeds,sample loss,and labor-intensive preparation procedures.Here,we demonstrate the development of a novel microfluidic chip that integrates droplet generation,on-demand electrostatic droplet charging,and high-throughput sorting.The charging electrode is a copper wire buried above the nozzle of the microchannel,and the deflecting electrode is the phosphate buffered saline in the microchannel,which greatly simplifies the structure and fabrication process of the chip.Moreover,this chip is capable of high-frequency droplet generation and sorting,with a frequency of 11.757 kHz in the drop state.The chip completes the selective charging process via electrostatic induction during droplet generation.On-demand charged microdroplets can arbitrarilymove to specific exit channels in a three-dimensional(3D)-deflected electric field,which can be controlled according to user requirements,and the flux of droplet deflection is thereby significantly enhanced.Furthermore,a lossless modification strategy is presented to improve the accuracy of droplet deflection or harvest rate from 97.49% to 99.38% by monitoring the frequency of droplet generation in real time and feeding it back to the charging signal.This chip has great potential for quantitative processing and analysis of single cells for elucidating cell-to-cell variations.
