The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate p...The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits.The formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.展开更多
Innovative approaches in ultrasonic assistant soldering consists of increasing the activity of cavitation and accelerating difiusion processes at the interface between the solder and the soldering material.Besides tha...Innovative approaches in ultrasonic assistant soldering consists of increasing the activity of cavitation and accelerating difiusion processes at the interface between the solder and the soldering material.Besides that,it improves the effectiveness of cavitation processes in melts by saturating gas cavities with diameters that are smaller than the resonant sizes of cavitation germs.Gas saturation of liquids and melts raises level of cavitation pressure by 20-25%,that intensifies US processing of cleaning,soldering and metallization.Modelling diffusion process showed that the US activation increased the concentration of diffusing elements of Zn and Al in the interface depth by 15-20% on average,and the combined activation by the US and electric field increased it by 30-45%.Furthemore,as the energy quantity adsorbed by melt increases,increased amplitude and frequency of US vibrations induces concentration rise.The heat energy was also boosted by combining the activation of the melt-soldered material system with US vibrations energy and high current pulses.This allows for a faster increase in soldering temperature,as well as improved solder wettability.展开更多
基金The 2019 Ministry of Education industry-university cooperation collaborative education project“Research on the Construction of Economics and Management Professional Data Analysis Laboratory”(Project number:201902077020)。
文摘The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits.The formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.
文摘Innovative approaches in ultrasonic assistant soldering consists of increasing the activity of cavitation and accelerating difiusion processes at the interface between the solder and the soldering material.Besides that,it improves the effectiveness of cavitation processes in melts by saturating gas cavities with diameters that are smaller than the resonant sizes of cavitation germs.Gas saturation of liquids and melts raises level of cavitation pressure by 20-25%,that intensifies US processing of cleaning,soldering and metallization.Modelling diffusion process showed that the US activation increased the concentration of diffusing elements of Zn and Al in the interface depth by 15-20% on average,and the combined activation by the US and electric field increased it by 30-45%.Furthemore,as the energy quantity adsorbed by melt increases,increased amplitude and frequency of US vibrations induces concentration rise.The heat energy was also boosted by combining the activation of the melt-soldered material system with US vibrations energy and high current pulses.This allows for a faster increase in soldering temperature,as well as improved solder wettability.
