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渗硼镀膜法制备TiBN薄膜的电子导电性及其潜在应用前景
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作者 胡建东 s.tosto +1 位作者 程春明 王红海 《电子元件与材料》 CAS CSCD 北大核心 2018年第11期55-60,共6页
报道一种新的TiBN薄膜制备方法和薄膜的导电性,该方法是以B_4C,SiC和KBF_4作为固体渗硼剂,钛粉末材料作为Ti源,采用低成本固体渗硼法(以下简称渗硼镀膜法)制备成TiBN薄膜。对该薄膜的电阻率进行了系统检测,发现薄膜具有优良的电子导电性... 报道一种新的TiBN薄膜制备方法和薄膜的导电性,该方法是以B_4C,SiC和KBF_4作为固体渗硼剂,钛粉末材料作为Ti源,采用低成本固体渗硼法(以下简称渗硼镀膜法)制备成TiBN薄膜。对该薄膜的电阻率进行了系统检测,发现薄膜具有优良的电子导电性,电阻率达到0.495×10^(-7)Ω·m,最好电阻率数值达到0.0778×10^(-7)Ω·m,优于用PVD方法在同样基体上制备的TiN薄膜的电阻率(82.7×10^(-7)Ω·m);优于Cu的电阻率(0.168×10^(-7)Ω·m);优于石墨的电阻率(平行于石墨层的(25~50)×10^(-7)Ω·m和垂直于石墨层的30000×10^(-7)Ω·m);优于无定型碳的电阻率((5000.0~8000.0)×10^(-7)Ω·m)。经300,400,500和600℃,5 h氧化处理的TiBN薄膜仍然保持良好的导电性(600℃时电阻率为0.641×10^(-7)Ω·m)。TiBN薄膜厚度为微米级,颗粒尺寸为纳米级,可用于制备新型、高效微电子器件、储能器电极、隔离体、集电体,在电子元件和储能器领域有潜在的应用前景。 展开更多
关键词 TiBN薄膜 固体渗硼剂 渗硼镀膜法 电阻率 导电性 储能装置
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Application of face centred cubic TiB powder as conductive filler for electrically conductive adhesives 被引量:1
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作者 赵健闯 胡建东 +1 位作者 焦东宁 s.tosto 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2014年第6期1773-1778,共6页
Face centred cubic(FCC) TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives(ECAs) with the polymer matrix.Electrically conductive ... Face centred cubic(FCC) TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives(ECAs) with the polymer matrix.Electrically conductive properties of the ceramic ECAs were studied.The bulk electrical resistivity varied with the powder content of the FCC-TiB in ECAs.The FCC-TiB filled ECAs also showed the percolation behavior that usually occurred for the metal-filled ECAs,the percolation threshold was located at the content of 60%FCC-TiB.A minimum value of 0.1 Ω·cm was obtained at a content of 75%FCC-TiB.In order to check the reliability of mechanical property,tensile test was done to measure the shear strength,and the shear strength dropped with increasing the content of FCC-TiB powders.It is about 12.26 MPa at the content of 70%TiB powders.The Cu filled ECAs were also prepared for comparison.The properties of the oxidation resistance of the two ECAs were evaluated.The results show that the ceramic ECAs have excellent oxidation resistance and better stability compared with the Cu filled ECAs. 展开更多
关键词 ceramic powder face centred cubic TIB electrically conductive adhesives bulk resistivity OXIDATION shear strength
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