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Effect of heavy ion irradiation on the interface traps of AlGaN/GaN high electron mobility transistors 被引量:1
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作者 Zheng-Zhao lin ling lü +4 位作者 Xue-Feng Zheng Yan-Rong Cao Pei-Pei Hu Xin Fang Xiao-Hua Ma 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第3期428-433,共6页
AlGaN/GaN high electron mobility transistors(HEMTs)were irradiated with heavy ions at various fluences.After irradiation by 2.1 GeV^(181) Ta^(32+) ions,the electrical characteristics of the devices significantly decre... AlGaN/GaN high electron mobility transistors(HEMTs)were irradiated with heavy ions at various fluences.After irradiation by 2.1 GeV^(181) Ta^(32+) ions,the electrical characteristics of the devices significantly decreased.The threshold voltage shifted positively by approximately 25%and the saturation currents decreased by approximately 14%.Defects were induced in the band gap and the interface between the gate and barrier acted as tunneling sites,which increased the gate current tunneling probability.According to the pulsed output characteristics,the amount of current collapse significantly increased and more surface state traps were introduced after heavy ion irradiation.The time constants of the induced surface traps were mainly less than 10μs. 展开更多
关键词 gallium nitride radiation effects DEFECTS pulse testing
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De-emulsification of 2-ethyl-1-hexanol/water emulsion using oil-wet narrow channel combined with low-speed rotation
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作者 ling lü Kejing Wu +2 位作者 You Tang Siyang Tang Bin liang 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2018年第10期2048-2054,共7页
Low-speed rotation of disc in an internal circulation of a novel de-emulsification with rotation-dise horizental contactor(RHC-D) realized de-emulsification for O/W emulsions due to repeated coalescence in oil-wet nar... Low-speed rotation of disc in an internal circulation of a novel de-emulsification with rotation-dise horizental contactor(RHC-D) realized de-emulsification for O/W emulsions due to repeated coalescence in oil-wet narrow channels at a low rotation speed. For three emulsions included ethanol/water/2-ethyl-1-hexanol, ethanol/water/2-ethyl-1-hexanol/SDS(Sodium Dodecyl Sulfonate) and 2-ethyl-1-hexanol/water/SDS emulsion, deemulsification ratios of oil phase could reach 1, 1 and 0.67 respectively at 170 r·min-1, and de-emulsification ratios increased obviously after agitating 10 min. De-emulsification experiment in the seam indicated that oil droplet sizes in O/W emulsion became larger after de-emulsification. The main de-emulsification mechanism in RHCD was the coalescence of oil droplets in oil-wet narrow channels. With increase of the rotation speed, oil droplets dispersed better in the aqueous phase. However, de-emulsification effect enhanced due to the increase of the coalescence rate at a bit higher rotation speed. In addition, internal circulation made those O/W emulsions to be broken repeatedly, consequently de-emulsification ratio increased. Repeated de-emulsification through internal circulation might make continuous extraction of ethanol come true at a low rotation speed. 展开更多
关键词 De-emulsification Oil-wet channel Low rotation speed O/W emulsion Internal circulation
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Investigation of etching method for fabricating deep through holes on ultra-high resistivity silicon
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作者 lin Du Shengrui Xu +3 位作者 Ying Wang ling lü Jincheng Zhang Yue Hao 《Journal of Semiconductors》 EI CAS CSCD 2017年第5期106-110,共5页
In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature... In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature of the substrate,the platen power and the etching intermittence had important influence on the etching rate and the etching morphology of the UHRS.The profiles and morphologies of sidewall were characterized with scanning electron microscopy(SEM).By using an improved three-stage Bosch process,380-μm deep through holes were fabricated on the UHRS with the average etching rate of about 3.14 μm/min.Meanwhile,the fabrication mechanism of deep through holes on the UHRS by using the three-stage Bosch process was illustrated on the basis of the experimental results. 展开更多
关键词 ultra-high resistivity silicon deep through hole three-stage etching method Bosch process
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