摘要
高端印制电路板是一种典型的异质多元多层复合材料,其上孔、槽、线路和图案等微细结构的加工质量决定了芯片、航空航天、5G/6G通信、超算等核心电子器件的使役性能。随着印制电路板材料组成越来越复杂、加工尺度极端微细化、加工质量要求高且评价体系复杂等,为高端印制电路板的孔、槽等微细结构激光加工带来巨大挑战。针对异质多元多层复合材料激光微细加工技术的研究进展进行综述,系统分析新材料、极端尺度微细结构对激光微细加工工艺带来的技术变革,并指出其面临的技术挑战和未来的发展方向,旨在为高端印制电路板的微细结构激光加工制造提供指导和借鉴。
High-end printed circuit board is the typical heterogeneous multilayer composite material.The quality of microstructures such as holes,slots,circuits,and patterns directly determine the operational performance of electronic devices in semiconductors,aerospace,5G/6G communications,and supercomputing.With the increasing complexity of printed circuit board materials and processing quality evaluation systems,the miniaturization of processing scales,and the high requirements for processing quality such as consistency and reliability,laser processing of high-end PCB is confronted with great challenges.This article provides a comprehensive review of the research progress in laser micromachining technology for heterogeneous multilayer composite materials.It systematically analyzes the technological changes brought about by new materials and extreme-scale structures in laser micromachining processes and identifies the technical challenges and future development directions.The aim is to provide guidance and reference for the manufacture of microstructures in high-end printed circuit boards through laser processing.
作者
郑李娟
孙勇
徐向前
余举满
王军
王成勇
ZHENG Lijuan;SUN Yong;XU Xiangqian;YU Juman;WANG Jun;WANG Chengyong(School of Electromechanical Engineeing,Guangdong University of Technology,Guangzhou 510006;State Key Laboratory for High Performance Tools,Guangzhou 510006)
出处
《机械工程学报》
2025年第1期305-325,共21页
Journal of Mechanical Engineering
基金
国家自然科学基金优秀青年基金(52122510)
国家自然科学基金面上(52375415)
鹏鼎控股(深圳)股份有限公司产学研(19HK0062)资助项目
